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RT/duroid 6010.2LM Rogers PCB Built on 50mil 1.27mm Laminates with Double Sided Copper and Immersion Silver

Shipped: 11th-Sep-2023  

Crafted using advanced ceramic PTFE composites, Rogers RT/duroid 6010.2LM printed circuit board sets a new standard for reliability and circuit performance.

The RT/duroid 6010.2LM PCB features remarkable properties that elevate your designs to new heights. With a dielectric constant of 10.2 at 10 GHz/23°C and a dissipation factor of 0.0023 at the same frequency, this PCB ensures exceptional signal integrity and minimal power loss. Operating seamlessly within a temperature range of -40°C to +85°C, it guarantees reliability and stability across diverse environments. Its coefficient of thermal expansion in X, Y, and Z directions is 24 ppm/°C, 24 ppm/°C, and 47 ppm/°C respectively, ensuring consistent performance even under varying thermal conditions.

RT/duroid 6010.2LM PCB’s high dielectric constant allows for circuit size reduction, enabling compact and efficient designs. With low loss characteristics, this PCB is ideal for operating at X-band or below, ensuring excellent performance in high-frequency applications. The low Z-axis expansion of the RT/duroid 6010.2LM PCB provides reliable plated through holes in multilayer boards, ensuring robust connectivity. Additionally, its low moisture absorption reduces the effects of moisture on electrical loss, enhancing long-term performance. The tight DK (dielectric constant) and thickness control of this PCB ensures repeatable circuit performance, guaranteeing consistent and reliable results.
This RT/duroid 6010.2LM PCB features a 2-layer rigid stackup configuration, consisting of finished copper layer 1 with a thickness of 35 μm, RT/duroid 6010.2LM dielectric with a thickness of 50 mil (1.27mm), and finished copper layer 2 with a thickness of 35 μm. These specifications guarantee superior performance and reliability for your designs.
When it comes to construction details, this RT/duroid 6010.2LM PCB leaves no room for compromise. With board dimensions of 40mm x 23mm (± 0.15mm), you have ample space to bring your creative designs to life. It supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.3mm, enabling intricate and precise circuit layouts. With no blind or buried vias, the RT/duroid 6010.2LM PCB ensures seamless connectivity and ease of manufacturing. The finished board thickness is 1.4mm, and the finished Cu weight is 1 oz (1.4 mils) on all layers, ensuring robustness and durability. The via plating thickness is 20 μm, guaranteeing excellent electrical connections. The surface finish is immersion silver, providing superior conductivity and corrosion resistance. The PCB does not feature any silkscreen or solder mask layers. Each PCB undergoes a comprehensive 100% electrical test, ensuring optimal performance and reliability. The 15mil/14mil track/gap ensures precise impedance control of 50 ohms, meeting the most demanding requirements.
This RT/duroid 6010.2LM PCB boasts impressive statistics, making it an ideal choice for a wide range of applications. It supports up to 22 components and offers a total of 41 pads, including 21 thru-hole pads and 20 top SMT pads. With 44 vias and 6 nets, this PCB provides excellent connectivity and signal routing capabilities.
Our RT/duroid 6010.2LM PCB supports Gerber RS-274-X artwork and adheres to the IPC-Class-2 quality standard, guaranteeing top-notch performance and reliability. With worldwide availability, this PCB solution is accessible to customers around the globe.
Unleash the power of the RT/duroid 6010.2LM PCB in a wide range of applications, including patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems. Its versatility and exceptional performance make it an ideal choice for demanding electronic designs.
For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Harness the power of precision with the RT/duroid 6010.2LM PCB and revolutionize your electronic designs.
PCB10
 

Item

Value

PCB Material

RT/duroid 6010.2LM ceramic PTFE composites

Dielectric Constant: 10.2 at 10 GHz, 23°C

Dissipation Factor: 0.0023 at 10 GHz

Coefficient of Thermal Expansion: X: 24 ppm/°C, Y: 24 ppm/°C, Z: 47 ppm/°C

-40℃?to +85℃?operation

Features and Benefits

- High dielectric constant for circuit size reduction

- Low loss. Ideal for operating at X-band or below

- Low Z-axis expansion. Provides reliable plated through holes in multilayer boards

- Low moisture absorption. Reduces effects of moisture on electrical loss

- Tight DK and thickness control for repeatable circuit performance

Stackup

2-layer rigid PCB

Finished Copper: 35 μm

RT/duroid 6010.2LM Dielectric: 50 mil (1.27 mm)

Finished Copper: 35 μm

Construction Details

Board Dimensions: 40 mm x 23 mm (1 PC), +/- 0.15 mm

Minimum Trace/Space: 7/8 mils

Minimum Hole Size: 0.3 mm

No blind or buried vias

Finished Board Thickness: 1.4 mm

Finished Cu Weight: 1 oz (1.4 mils) all layers

Via Plating Thickness: 20 μm

Surface Finish: Immersion Silver

Top Silkscreen: No

Bottom Silkscreen: No

Top Solder Mask: No

Bottom Solder Mask: No

100% Electrical Test Used

15 mil/14 mil track/gap

50 ohm impedance controlled

PCB Statistics

Components: 22

Total Pads: 41

Thru Hole Pads: 21

Top SMT Pads: 20

Bottom SMT Pads: 0

Vias: 44

Nets: 6

Type of Artwork Supplied

Gerber RS-274-X

Accepted Standard

IPC-Class-2

Service Area

Worldwide

Some Typical Applications

- Patch Antennas

- Satellite Communications Systems

- Power Amplifiers

- Aircraft Collision Avoidance Systems

- Ground Radar Warning Systems

  PCBBACK TO SEPTEMBER
 

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