RT/duroid 5880 PCB Supplier

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RT/duroid 5880 Printed Circuit Board

Introduction

Greetings everyone,
Today, we would like to introduce you to a high-frequency PCB that utilizes the reliable RT/duroid 5880 laminates.

The RT/duroid 5880 laminates from Rogers are specifically designed for precise stripline and microstrip circuit applications. These laminates consist of PTFE composites reinforced with glass microfibers, offering exceptional performance in high-frequency scenarios.

One of the notable features of RT/duroid 5880 laminates is their low dielectric constant (Dk) and low dielectric loss, which makes them highly suitable for high-frequency and broadband applications. Their low Dk ensures minimal signal loss and excellent signal integrity.

The presence of randomly oriented microfibers within the laminate contributes to exceptional dielectric constant uniformity. This means that the dielectric constant remains consistent from panel to panel and remains stable over a wide frequency range. Such uniformity is crucial for maintaining consistent electrical performance across the entire PCB.

Additionally, the low dissipation factor of RT/duroid 5880 laminates extends their usability to frequencies in the Ku-band and beyond. This property allows these laminates to effectively handle high-frequency signals without significant energy loss or degradation.

Data sheet

RT/duroid 5880 Data Sheet Summary:

Dielectric Constant:
Process: 2.20 (2.20±0.02 spec.) at 1 MHz, C24/23/50 test method
Design: 2.2 at 8 GHz to 40 GHz, determined using the Differential Phase Length Method

Dissipation Factor (tanδ):
Process: 0.0004 at 1 MHz, C24/23/50 test method
Process: 0.0009 at 10 GHz, IPC-TM 2.5.5.5 test method
Thermal Coefficient of ε: -125 ppm/°C in the temperature range of -50°C to 150°C, IPC-TM-650 2.5.5.5 test method

Volume Resistivity: 2 x 10^7 Mohm cm, measured using ASTM D 257

Surface Resistivity: 3 x 10^7 Mohm, measured using ASTM D 257

Specific Heat: 0.96 j/g/°C (0.23 cal/g/°C), calculated value

Tensile Modulus:
Test at 23°C: 1070 MPa (156 kpsi) in the X direction, 860 MPa (125 kpsi) in the Y direction
Test at 100°C: 450 MPa (65 kpsi) in the X direction, 380 MPa (55 kpsi) in the Y direction

Ultimate Stress:
Test at 23°C: 29 MPa (4.2 kpsi) in the X direction, 27 MPa (3.9 kpsi) in the Y direction
Test at 100°C: 20 MPa (2.9 kpsi) in the X direction, 18 MPa (2.6 kpsi) in the Y direction

Ultimate Strain:
Test at 23°C: 6% in the X direction, 4.9% in the Y direction
Test at 100°C: 7.2% in the X direction, 5.8% in the Y direction

Compressive Modulus:
Test at 23°C: 710 MPa (103 kpsi) in the X and Y directions, 940 MPa (136 kpsi) in the Z direction
Test at 100°C: 500 MPa (73 kpsi) in the X and Y directions, 670 MPa (97 kpsi) in the Z direction

Moisture Absorption: 0.02% for 0.62" (1.6mm) thickness, ASTM D 570 test method

Thermal Conductivity: 0.2 W/m/°C at 80°C, ASTM C 518 test method

Coefficient of Thermal Expansion:
X direction: 31 ppm/°C in the range of 0-100°C
Y direction: 48 ppm/°C in the range of 0-100°C
Z direction: 237 ppm/°C in the range of 0-100°C

Td (Thermal Decomposition Temperature): 500°C, determined using TGA (Thermogravimetric Analysis), ASTM D 3850 test method

Density: 2.2 gm/cm3, measured using ASTM D 792

Copper Peel: 31.2 pli (5.5 N/mm) for 1oz (35mm) EDC foil after solder float, IPC-TM-650 2.4.8 test method

Flammability: V-0 rating, UL 94 test method

Lead-free Process Compatible: Yes

RT/duroid 5880 Typical Value
Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 107		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 107		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23）		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23℃	Test at 100℃	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
Ultimate Stress	27(3.9）	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
Ultimate Strain	4.9	5.8	Y	%
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80℃	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/℃	0-100℃	IPC-TM-650 2.4.41
Td	500		N/A	℃ TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm3	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

PCB Capability (RT/duroid 5880)

Our manufacturing capability for RT/duroid 5880 includes various options to accommodate different design requirements. We can produce single-sided, double-sided, multi-layer, and hybrid PCBs using the versatile RT/duroid 5880 laminates.

When it comes to copper weight, we offer flexibility with options such as 1oz (35µm) and 2oz (70µm). This allows us to meet specific conductivity needs for different applications.

Laminate thickness is another aspect we consider. With RT/duroid 5880, we provide choices ranging from 5mil (0.127mm) to 62mil (1.575mm). This versatility allows us to accommodate varying mechanical and electrical requirements for our customers' PCB designs.

In terms of PCB size, we can manufacture boards up to ≤400mm X 500mm using RT/duroid 5880 laminates. This ensures that we can handle a wide range of board dimensions while maintaining the material's performance characteristics.

To cater to different preferences and industry requirements, we offer a selection of solder mask colors including green, black, blue, yellow, red, and more. This allows our customers to customize the appearance of their PCBs based on their desired aesthetics or specific industry standards.

When it comes to surface finish, we provide multiple options such as bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG, pure gold, OSP, and more. These options address various needs for solderability, corrosion resistance, and overall PCB performance.

PCB Capability (RT/duroid 5880)
PCB Material:	Glass microfiber reinforced PTFE composites
Designation:	RT/duroid 5880
Dielectric constant:	2.20±0.02
Layer count:	Single Sied, Double Sided, Multi-layer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	5mil (0.127mm), 10mil (0.254mm), 20mil(0.508mm), 31mil (0.787mm), 62mil(1.575mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..

Applications

RT/duroid 5880 PCBs are widely used in various applications, including:
Commercial Airline Broadband Antennas, Microstrip and Stripline Circuits, Millimeter Wave Applications, Military Radar Systems, Missile Guidance Systems, Point to Point Digital Radio Antennas etc.