RT/duroid 5870 PCB Supplier

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RT/duroid 5870 High Frequency PCB

Introduction

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In today's article, we will be discussing the construction of high-frequency PCBs utilizing RT/duroid 5870 laminates.

Rogers RT/duroid 5870 laminates are advanced PTFE composites that incorporate glass microfibers for reinforcement. These laminates offer exceptional performance in high-frequency applications, characterized by a low dielectric constant (Dk). The incorporation of randomly oriented microfibers within the PTFE composites ensures a remarkable level of Dk uniformity. With its low Dk loss, RT/duroid 5870 laminates are particularly well-suited for high-frequency and broadband applications where minimizing dispersion and losses is crucial. These laminates extend their effectiveness to frequencies in the Ku-band and beyond.

Thank you for tuning in, and let's delve into the details of high-frequency PCBs built on RT/duroid 5870 laminates.

Data sheet

During the manufacturing process, the dielectric constant (εProcess) of RT/duroid 5870 is 2.33 with a tolerance of ±0.02. This value is measured in the Z direction at frequencies of 1 MHz (IPC-TM-650 2.5.5.3) and 10 GHz (IPC-TM 2.5.5.5).

The design dielectric constant of RT/duroid 5870 is 2.33, measured in the Z direction. The measurements are performed within the frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method.

The dissipation factor of RT/duroid 5870 is 0.0005 at C24/23/50 and 0.0012 at 10 GHz. This value is measured in the Z direction at frequencies of 1 MHz (IPC-TM-650 2.5.5.3) and 10 GHz (IPC-TM 2.5.5.5).

RT/duroid 5870 has a thermal coefficient of the dielectric constant of -115 ppm/℃. This measurement is conducted over a temperature range of -50℃ to 150℃ (IPC-TM-650 2.5.5.5).

The volume resistivity of RT/duroid 5870 is 2 x 10^7 Mohm cm. This value is measured in the Z direction at C/96/35/90 (ASTM D 257).

RT/duroid 5870 has a surface resistivity of 2 x 10^7 Mohm at C/96/35/90 (ASTM D 257).

The specific heat of RT/duroid 5870 is 0.96 joules/gram/kelvin (0.23 cal/g/°C). The specific heat is calculated.

In the X direction, the tensile modulus of RT/duroid 5870 is 1300 MPa (189 kpsi) at 23℃ and 490 MPa (71 kpsi) at 100℃. In the Y direction, it is 1280 MPa (185 kpsi) at 23℃ and 430 MPa (63 kpsi) at 100℃. The measurements are conducted according to ASTM D 638.

The ultimate stress of RT/duroid 5870 is 50 MPa (7.3 kpsi) in the X direction and 42 MPa (6.1 kpsi) in the Y direction, tested at 23℃.

The ultimate strain of RT/duroid 5870 is 9.8% in the X direction and 8.7% in the Y direction, tested at 23℃.

In the X direction, the compressive modulus of RT/duroid 5870 is 1210 MPa (176 kpsi), 1360 MPa (198 kpsi) in the Y direction, and 803 MPa (120 kpsi) in the Z direction at 23℃. The measurements are conducted according to ASTM D 695.

The ultimate stress of the compressive modulus is 30 MPa (4.4 kpsi) in the X direction, 37 MPa (5.3 kpsi) in the Y direction, and 54 MPa (7.8 kpsi) in the Z direction, tested at 23℃.

The ultimate strain of the compressive modulus is 4% in the X direction, 3.3% in the Y direction, and 8.7% in the Z direction, tested at 23℃.

The moisture absorption of RT/duroid 5870 is 0.02% when tested with a thickness of 0.62" (1.6 mm) according to D48/50 (ASTM D 570).

The thermal conductivity of RT/duroid 5870 is 0.22 W/m/k in the Z direction at 80℃ (ASTM C 518).

The coefficient of thermal expansion of RT/duroid 5870 is 22 ppm/℃ in the X direction, 28 ppm/℃ in the Y direction, and 173 ppm/℃ in the Z direction. The measurements areconducted from 0℃ to 100℃ (IPC-TM-650 2.4.41).

The decomposition temperature (Td) of RT/duroid 5870 is 500℃. The Td value is determined using Thermogravimetric Analysis (TGA) and tested according to ASTM D 3850.

The density of RT/duroid 5870 is 2.2 gm/cm3, measured in grams per cubic centimeter. The density measurement is performed according to ASTM D 792.

The copper peel strength of RT/duroid 5870 is 27.2 Pounds per linear inch (4.8 N/mm). This measurement is taken on 1 oz (35mm) Electro-Deposited Copper (EDC) foil after a solder float process. The testing is conducted according to IPC-TM-650 2.4.8.

RT/duroid 5870 has a flammability rating of V-0. This rating indicates that the material has passed the UL 94 flammability test and is considered to be self-extinguishing.

RT/duroid 5870 is compatible with lead-free manufacturing processes. This means that the material can be used without issues in electronic assemblies that comply with lead-free regulations.

RT/duroid 5870 Typical Value
Property	RT/duroid 5870		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.33 2.33±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.33		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0005 0.0012		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-115		Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 107		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	2 x 107		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23℃	Test at 100℃	N/A	MPa(kpsi)	A	ASTM D 638
	1300(189)	490(71)	X
	1280(185)	430(63)	Y
Ultimate Stress	50(7.3)	34(4.8)	X
Ultimate Stress	42(6.1)	34(4.8)	Y
Ultimate Strain	9.8	8.7	X	%
Ultimate Strain	9.8	8.6	Y	%
Compressive Modulus	1210(176)	680(99）	X	MPa(kpsi)	A	ASTM D 695
	1360(198)	860(125)	Y
	803(120)	520(76)	Z
Ultimate Stress	30(4.4)	23(3.4）	X
	37(5.3)	25(3.7)	Y
	54(7.8)	37(5.3)	Z
Ultimate Strain	4	4.3	X	%
	3.3	3.3	Y
	8.7	8.5	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.22		Z	W/m/k	80℃	ASTM C 518
Coefficient of Thermal Expansion	22 28 173		X Y Z	ppm/℃	0-100℃	IPC-TM-650 2.4.41
Td	500		N/A	℃ TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm3	N/A	ASTM D 792
Copper Peel	27.2(4.8)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

PCB Capability (RT/duroid 5870)

At our facility, we possess the expertise to produce PCBs with different layer counts. Whether it's a simple single-sided board, a more intricate double-sided design, a multi-layer PCB, or a hybrid configuration combining various technologies, we have the manufacturing capabilities to bring these concepts to life. Our skilled technicians and advanced equipment allow us to handle projects of varying complexity and deliver high-quality results.

We understand that copper weight plays a critical role in the performance and durability of PCBs. To address this, we offer PCBs with copper weights of 1oz (35µm) and 2oz (70µm). This flexibility enables our customers to choose the appropriate copper weight based on their specific requirements, ensuring optimal conductivity and structural integrity.

The dielectric thickness of a PCB is another crucial factor that affects its functionality and reliability. To cater to diverse needs, we provide a range of dielectric thickness options. Our offerings include 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), and 62mil (1.575mm). This selection empowers our customers to select the dielectric thickness that best suits their applications, striking the right balance between electrical performance and mechanical stability.

In today's fast-paced technology landscape, PCBs come in various sizes and form factors. Our manufacturing capabilities accommodate PCBs with dimensions up to 400mm X 500mm. This generous size allowance enables us to cater to a wide range of applications, from compact handheld devices to larger industrial systems.

The solder mask not only protects the PCB's copper traces but also provides visual identification and insulation. To cater to individual preferences, we offer an array of solder mask color options. Choose from popular colors such as Green, Black, Blue, Yellow, Red, and more. By allowing customers to select their desired solder mask color, we ensure that their PCBs align with their aesthetic preferences and branding requirements.

The surface finish of a PCB influences its solderability, electrical performance, and longevity. Understanding the significance of this aspect, we provide a wide range of surface finish options. Our offerings include Immersion Gold, HASL (Hot Air Solder Leveling), Immersion Silver, Immersion Tin, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), OSP (Organic Solderability Preservative), Bare Copper, Pure Gold, and more. This comprehensive selection empowers our customers to choose the most suitable surface finish for their specific applications, ensuring optimal functionality and reliability.

PCB Capability (RT/duroid 5870)
PCB Material:	Glass Microfiber Reinforced PTFE Composites
Designation:	RT/duroid 5870
Dielectric constant:	2.33 +/-0.02 at 10 GHz
Dissipation factor	0.0012 at 10GHz
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

A PCB and Applications

Displayed on the screen is a 62 mils thick RT/duroid 5870 PCB featuring an immersion gold surface finish.

In our daily lives, we come across a wide range of applications where this particular type of PCB is employed. These applications span various industries, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave technologies, radar systems, and point-to-point digital radio antennas. The versatility of this PCB makes it an integral component in these diverse and important applications.