Are you ready to take your PCB designs to the next level? Look no further than the revolutionary RT/duroid 6035HTC PCB. We are pleased to introduce our Rogers RT/duroid 6035HTC High Frequency PCB, built on 30mil (0.762mm) substrates. Let's delve into its features and specifications, along with other essential details of this latest PCB shipment.

Rogers RT/duroid 6035HTC is a cutting-edge PCB substrate known for its exceptional properties. It is composed of ceramic filled PTFE composites, which provide remarkable performance benefits. Some key specifications of this substrate include:

DK (Dielectric Constant): With a DK of 3.5 +/- 0.05 at 10 GHz/23°C, the substrate ensures reliable signal transmission and impedance control.

Dissipation Factor: The low dissipation factor of 0.0013 at 10 GHz/23°C contributes to minimal signal loss, making it ideal for high-frequency applications.

Thermal Coefficient of er:?With a thermal coefficient of er of -66 ppm/°C, the substrate exhibits excellent stability over a wide temperature range, ensuring consistent performance.

Moisture Absorption: The substrate has a moisture absorption rate of 0.06%, indicating its resistance to moisture-related issues.

Thermal Conductivity: Its impressive thermal conductivity of 1.44 W/m/K at 80°C enables efficient heat dissipation, contributing to lower operating temperatures.

a. High Thermal Conductivity:?The substrate's improved dielectric heat dissipation allows for lower operating temperatures, making it suitable for high-power applications.

b. Low Loss Tangent:?With excellent high-frequency performance, this substrate minimizes signal loss and ensures reliable transmission in demanding electronic systems.

c. Thermally Stable Low Profile and Reverse Treat Copper Foil: The use of copper foil with thermal stability and a reverse treatment process reduces insertion loss and enhances the overall stability of traces.

d. Advanced Filler System:?The substrate incorporates an advanced filler system, resulting in improved drillability and extended tool life compared to circuit materials containing alumina.

PCB Stackup and Construction Details:

This?PCB is a 2-layer rigid board constructed as follows:

Copper Layer 1: 35 μm
RT/duroid 6035HTC: 0.762 mm (30 mil)
Copper Layer 2: 35 μm

The construction details of the PCB include specific dimensions, trace and space requirements, hole sizes, and other important specifications. Notable details are as follows:

Board Dimensions: The PCB measures 39.86mm x 43 mm, with a tolerance of +/- 0.15mm.
Minimum Trace/Space: The board requires a minimum trace width of 4 mils and a minimum space of 6 mils.
Minimum Hole Size: The PCB supports a minimum hole size of 0.3mm.
No Blind Vias: The board does not feature blind vias.
Finished Board Thickness: The finished board thickness is 0.8mm.
Finished Cu Weight: The outer layers have a finished copper weight of 1oz (1.4 mils).
Via Plating Thickness: Vias are plated with a thickness of 20 μm.
Surface Finish: The surface finish is Immersion Gold.
Silkscreen and Solder Mask: The board does not have any silkscreen or solder mask on the top or bottom layers.
Via Filling: Vias with a diameter of 0.3mm are filled and capped.
Electrical Testing: 100% electrical testing is performed before shipment to ensure quality and functionality.

PCB Statistics

The PCB contains 10 components and a total of 40 pads. It features 26 thru-hole pads and 14 top SMT pads, with no bottom SMT pads. There are 31 vias and 2 nets incorporated into the design.

Type of Artwork Supplied and Accepted Standard

The artwork supplied for this PCB is in Gerber RS-274-X format, a widely accepted industry standard for PCB fabrication and manufacturing. The accepted standard for this PCB is IPC-Class-2, ensuring adherence to quality and reliability standards.

Availability and Typical Applications