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Rogers RT/duroid 6035HTC High Frequency PCB Built on 20mil 0.508mm Substrates

Shipped: 27th-Oct-2023  

We are pleased to introduce our Rogers RT/duroid 6035HTC High Frequency PCB, built on 20mil (0.508mm) substrates. This advanced PCBs are highly regarded for their exceptional performance in power applications.

Substrates Introduction

Rogers RT/duroid 6035HTC PCB substrates are ceramic-filled PTFE composites designed for high-performance applications. They offer impressive specifications, including a DK of 3.5 +/- 0.05 at 10 GHz/23°C, a dissipation factor of 0.0013 at 10 GHz/23°C, a thermal coefficient of er of -66 ppm/°C, moisture absorption of 0.06%, thermal conductivity of 1.44 W/m/K at 80°C, and a CTE of 19 ppm/°C in the X-axis, 19 ppm/°C in the Y-axis, and 39 ppm/°C in the Z-axis.

Substrates Features

Rogers RT/duroid 6035HTC PCB substrates offer several notable features:

High thermal conductivity for improved heat dissipation in high-power applications, resulting in lower operating temperatures.
Low loss tangent, providing excellent high-frequency performance.
Thermally stable low-profile and reverse-treated copper foil, minimizing insertion loss and ensuring excellent thermal stability of traces.
Advanced filler system, enhancing drillability and extending tool life compared to alumina-containing circuit materials.

PCB Stackup

This?RT/duroid 6035HTC PCBs?follow a 2-layer rigid PCB stackup:
Copper_layer_1: 35 μm
RT/duroid 6035HTC: 0.508 mm (20mil)
Copper_layer_2: 35 μm

PCB Construction Details

The construction details of this Rogers RT/duroid 6035HTC PCBs are as follows:
Board dimensions: 150.2mm x 66.5 mm = 1PCS, with a tolerance of +/- 0.15mm.
Minimum Trace/Space: 7/7 mils.
Minimum Hole Size: 0.5mm.
No blind vias.
Finished board thickness: 0.6mm.
Finished Cu weight: 1oz (1.4 mils) on outer layers.
Via plating thickness: 20 μm.
Surface finish: Immersion Silver.
Top Silkscreen: No.
Bottom Silkscreen: No.
Top Solder Mask: No.
Bottom Solder Mask: No.
100% Electrical test used prior to shipment.

PCB Statistics

This RT/duroid 6035HTC PCBs?exhibit the following statistics:
Components: 15.
Total Pads: 68.
Thru Hole Pads: 37.
Top SMT Pads: 31.
Bottom SMT Pads: 0.
Vias: 39.
Nets: 4.
Type of Artwork Supplied: Gerber RS-274-X.
Accepted Standard: IPC-Class-2.
Availability: Worldwide.

Typical Applications

Rogers RT/duroid 6035HTC PCBs?find applications in various industries, including:

High power RF and microwave amplifiers.
Power amplifiers, couplers, filters, combiners, power dividers.

 
 

Parameter

Value

PCB Substrates

Rogers RT/duroid 6035HTC ceramic filled PTFE composites

 

DK of 3.5 +/- 0.05 at 10 GHz/23°C

 

Dissipation factor of 0.0013 at 10 GHz/23°C

 

Thermal Coefficient of er of -66 ppm/°C

 

Moisture Absorption 0.06%

 

Thermal Conductivity of 1.44 W/m/K at 80°C

 

CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axix of 39ppm/°C

Features

High Thermal conductivity

 

Low loss tangent

 

Thermally stable low profile and reverse treat copper foil

 

Advanced filler system

Stackup

2-layer rigid PCB

 

Copper_layer_1 - 35 μm

 

RT/duroid 6035HTC - 0.508 mm (20mil)

 

Copper_layer_2 - 35 μm

Construction Details

Board dimensions: 150.2mm x 66.5 mm=1PCS, +/- 0.15mm

 

Minimum Trace/Space: 7/7 mils<br>- Minimum Hole Size: 0.5mm

 

No Blind vias.

 

Finished board thickness: 0.6mm

 

Finished Cu weight: 1oz (1.4 mils) outer layers

 

Via plating thickness: 20 μm

 

Surface finish: Immersion Silver

 

Top Silkscreen: No

 

Bottom Silkscreen: No

 

Top Solder Mask: No

 

Bottom Solder Mask: No

 

100% Electrical test used prior to shipment

PCB Statistics

Components: 15

 

Total Pads: 68

 

Thru Hole Pads: 37

 

Top SMT Pads: 31

 

Bottom SMT Pads: 0

 

Vias: 39

 

Nets: 4

Type of artwork supplied

Gerber RS-274-X

Accepted standard

IPC-Class-2

Availability

Worldwide

Typical Applications

High power RF and microwave amplifiers

 

Power amplifiers, couplers, filters

 

Combiners, power dividers

  PCBBACK TO OCTOBER
 

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