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RO4835 High Frequency PCB Built on 6.6mil 0.168mm Substrates

Shipped: 18th-Oct-2023

We are pleased to introduce our RO4835 High Frequency PCB, built on 6.6mil (0.168mm) substrates. RO4835 PCB substrates, developed by Rogers, are hydrocarbon/ceramic/woven glass laminates that offer exceptional performance and reliability.

Substrates Introduction

RO4835 PCB substrates feature Rogers' advanced hydrocarbon/ceramic/woven glass laminates. The key specifications include:
Rogers RO4835 Hydrocarbon/Ceramic/Woven Glass Laminates
Dielectric Constant (DK): 3.48 +/- 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Coefficient of er (TcDK): +50 ppm/°C ranging from -100 to 250°C
Tg greater than 280°C
Moisture Absorption: 0.05%
CTE in X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 31 ppm/°C

Substrates Features

RO4835 PCB substrates offer numerous advantages for various applications:
Significantly improved oxidation resistance compared to typical thermoset microwave materials
Designed for performance-sensitive, high-volume applications
Low loss with excellent electrical performance for higher operating frequencies
Ideal for automotive applications
Tight dielectric constant tolerance for controlled impedance transmission lines
Lead-free process compatible without blistering or delamination
Low Z-axis expansion for reliable plated through holes
Low in-plane expansion coefficient remains stable over a range of circuit processing temperatures
CAF resistant

PCB Stackup

This RO4835 PCB is used in 2-layer rigid PCB stackups with the following configuration:
Copper_layer_1: 35 μm
RO4835 Core: 0.168 mm (6.6 mils)
Copper_layer_2: 35 μm

PCB Construction Details

The construction details of this RO4835 PCB are as follows:
Board dimensions: 5mm x 9mm = 1PCS, +/- 0.15mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2mm
No blind vias
Finished board thickness: 0.3mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment

PCB Statistics

This RO4835 PCB demonstrates?the following statistics:
Components: 1
Total Pads: 3
Thru Hole Pads: 2
Top SMT Pads: 1
Bottom SMT Pads: 0
Vias: 2
Nets: 1

Type of Artwork Supplied

RO4835 PCB utilizes Gerber RS-274-X artwork format.

Accepted Standard

RO4835 PCBs comply with the IPC-Class-2 quality standard.

Availability

Our RO4835 PCBs are available worldwide, ensuring accessibility for various industries and markets.

Typical Applications

RO4835 PCBs find applications in numerous industries, including:
Automotive radar and sensors
Point-to-point microwave
Power amplifiers
Phased-array radar
RF components

Parameter	Value
PCB Substrates	Rogers RO4835, Hydrocarbon / Ceramic / Woven Glass
	Dielectric Constant (DK) of 3.48 +/- 0.05 at 10 GHz/23°C
	Dissipation factor of 0.0037 at 10 GHz/23°C
	Thermal Coefficient of er (TcDK) of +50 ppm/°C ranging -100~250°C
	Tg greater than 280°C
	Moisture Absorption 0.05%
	CTE in X-axis of 10 ppm/°C, Y-axis of 12ppm/°C and Z-axis of 31ppm/°C
Features	Significantly improved oxidation resistance compared to typical thermoset microwave materials
	Low loss
	Excellent electrical performance allows application with higher operating frequencies
	Ideal for automotive applications
	Tight dielectric constant tolerance
	Controlled impedance transmission lines
	Lead-free process compatible
	No blistering or delamination
	Low Z-axis expansion
	Reliable plated through holes
	Low in-plane expansion coefficient
	Remains stable over an entire range of circuit processing temperatures
	CAF resistant
Stackup	2-layer rigid PCB
	Copper_layer_1 - 35 μm
	RO4835 - 0.168 mm (6.6mil)
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 5mm x 9 mm = 1PCS, +/- 0.15mm
	Minimum Trace/Space: 4/4 mils
	Minimum Hole Size: 0.2mm
	No Blind vias.
	Finished board thickness: 0.3mm
	Finished Cu weight: 1oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: NO
	Bottom Silkscreen: No
	Top Solder Mask: NO
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 1
	Total Pads: 3
	Thru Hole Pads: 2
	Top SMT Pads: 1
	Bottom SMT Pads: 0
	Vias: 2
	Nets: 1
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Availability	Worldwide
Typical Applications	Automotive Radar and Sensors
	Point-to-point Microwave
	Power Amplifiers
	Phased-Array Radar
	RF Components

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