RO4725JXR PCB Supplier

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RO4725JXR PCB 2-layer 30.7mil

Shipped: 22nd-May-2024

1. Introduction of RO4725JXR
Rogers RO4725JXR Hydrocarbon / Ceramic / Woven Glass antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates.

The resin systems of RO4725JXR dielectric materials provide the necessary properties for ideal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4725JXR laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.

RO4725JXR laminates have the mechanical and electrical properties that antenna designers need. The laminates have a dielectric constant (Dk) of 2.55 and a loss tangent (Df) of 0.0022 measured at 2.5 GHz when using LoPro? Reverse Treated EDC Foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with a demonstrated low PIM performance, with values better than -160 dBc (43dBm 1,900MHz signal).

2. Features
- Dielectric Constant of DK 2.55 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0026 at 10GHz/23°C and 0.0022 at 2.5GHz
- Excellent Thermal Coefficient of Dielectric Constant +34 ppm/°C
- CTE matched to copper with X axis of 13.9 ppm/°C, Y axis of 19 ppm/°C, Z axis of 25.6 ppm/°C
- High Tg value of >280 °C
- Perfect PIM value of -166 dBC

3. Benefits:
- Low loss dielectric with low profile foil
- Low insertion loss
- Dk matched to standard PTFE based antenna offerings
- Reduced passive inter-modulation (PIM)
- Consistent circuit performance

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4725JXR Core - 0.78 mm (30.7mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 42.13mm x 112.96 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 35
Total Pads: 149
Thru Hole Pads: 92
Top SMT Pads: 57
Bottom SMT Pads: 0
Vias: 34
Nets: 3

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Cellular Base Station Antennas

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