RO4535 PCB 30mil| Bicheng PCB

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RO4535 High Frequency PCB Built on 30mil 0.762mm Substrates

Shipped: 17th-Oct-2023

We are excited to introduce our RO4535 High Frequency PCB, built on 30mil (0.762mm) substrates. This state-of-the-art PCBs are ceramic-filled, glass-reinforced hydrocarbon laminates that offer exceptional performance and reliability.

Substrates Introduction RO4535 PCB substrates feature Rogers' advanced ceramic-filled, glass-reinforced hydrocarbon laminates. The key specifications include: Dielectric Constant (DK): 3.41 at 10GHz Dissipation Factor: 0.0037 at 10GHz PIM (typical) value: -157 dBC X axis CTE: 16ppm/°C, Y axis CTE: 17ppm/°C, Z axis CTE: 50ppm/°C Tg >280 °C Operating Temperature Range: -40℃ to +85℃

Substrate Features and Benefits RO4535 PCB substrates offer numerous advantages for various applications: Low loss, low dielectric constant, and low PIM response for a wide range of applications Thermoset resin system compatible with standard PCB fabrication processes Excellent dimensional stability for greater yield on larger panel sizes Uniform mechanical properties for maintaining mechanical form during handling High thermal conductivity for improved power handling

PCB Stackup This RO4535 PCB is used in 2-layer rigid PCB stackups with the following configuration: Copper_layer_1: 35 μm Rogers 4535 Core: 0.762 mm Copper_layer_2: 35 μm

PCB Construction Details The construction details of this RO4535 PCB are as follows: Board dimensions: 94.05mm x 116.05mm = 1PCS, +/- 0.15mm Minimum Trace/Space: 6/7 mils Minimum Hole Size: 0.35mm No blind vias Finished board thickness: 0.88mm Finished Cu weight: 1oz (1.4 mils) outer layers Via plating thickness: 20 μm Surface finish: Immersion Gold Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: Green Bottom Solder Mask: Green 100% Electrical test used prior to shipment

PCB Statistics This RO4535 PCB demonstrates the following statistics: Components: 134 Total Pads: 243 Thru Hole Pads: 130 Top SMT Pads: 113 Bottom SMT Pads: 0 Vias: 271 Nets: 9

Type of Artwork Supplied RO4535 PCB utilizes Gerber RS-274-X artwork format.

Quality Standard RO4535 PCBs comply with the IPC-Class-2 quality standard.

Availability Our RO4535 PCB are available worldwide, ensuring accessibility for various industries and markets.

Typical Applications RO4535 PCBs find applications in numerous industries, including: Cellular infrastructure base station antennas WiMAX antenna networks

Parameter	Value
PCB Substrates	Rogers RO4535 Ceramic-filled, Glass-reinforced Hydrocarbon Laminates
	Dielectric Constant (DK): 3.41 at 10GHz
	Dissipation Factor: 0.0037 at 10GHz
	PIM (typical) value: -157 dBC
	X axis CTE: 16ppm/°C, Y axis CTE: 17ppm/°C, Z axis CTE: 50ppm/°C
	Tg >280 °C
	-40℃ to +85℃?operation
Features and Benefits	Low Loss, Low Dk and low PIM response for wide range of application use
	Thermoset resin system compatible with standard PCB fabrication
	Excellent dimensional stability for greater yield on larger panels sizes
	Uniform mechanical properties for maintaining mechanical form during handling
	High thermal conductivity for improved power handling
Stackup	2-layer rigid PCB
	Copper_layer_1 - 35 μm
	Rogers 4535 Core - 0.762 mm
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 94.05mm x 116.05 mm = 1PCS, +/- 0.15mm
	Minimum Trace/Space: 6/7 mils
	Minimum Hole Size: 0.35mm
	No Blind vias.
	Finished board thickness: 0.88mm
	Finished Cu weight: 1oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: Green
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: Green
	100% Electrical test used prior to shipment
PCB Statistics	Components: 134
	Total Pads: 243
	Thru Hole Pads: 130
	Top SMT Pads: 113
	Bottom SMT Pads: 0
	Vias: 271
	Nets: 9
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Typical Applications	Cellular infrastructure base station antennas
Typical Applications	WiMAX antenna networks

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