Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4534 PCB 2-layer 30mil

Shipped: 17th-July-2024  

1. Introduction of RO4534
RO4534 High Frequency Laminates are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets.

RO4534 laminates extend the capabilities of the successful RO4000 product series into antenna applications. This ceramic-filled, glass-reinforced hydrocarbon based material set provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
RO4534 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates
do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. This product is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas.
2. Features
- Dielectric Constant of DK 3.4 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- PIM (typical) value of -157 dBC
- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C
- Tg >280 °C
- Low Moisture Absorption of 0.06%
- Lead-Free Process Compatible
3. Benefits:
- Low Loss, Low Dk and low PIM response for wide range of application use
- Thermoset resin system compatible with standard PCB fabrication
- Excellent dimensional stability for greater yield on larger panels sizes
- Uniform mechanical properties for maintaining mechanical form during handling
- High thermal conductivity for improved power handling
- CTE similar to that of copper, reducing stress in PCB antenna
4. Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4534 Core - 0.762 mm
Copper_layer_2 - 35 μm
5. Construction details:
- Board dimensions: 73.2mm x 36.44 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: White
- Bottom Silkscreen: Blue
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 22
Total Pads: 58
Thru Hole Pads: 31
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 41
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide
10. Some Typical Applications:
- Cellular infrastructure base station antennas
- WiMAX antenna networks
 
 
 
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