RO4534 PCB 20mil | Bicheng PCB

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RO4534 High Frequency PCB Built on 20mil 0.508mm Substrates

Shipped: 16th-Oct-2023

We are thrilled to share with you our latest delivery of RO4534 High Frequency PCB, built on 20mil (0.508mm) substrates.RO4534 substrates, manufactured by Rogers, offer exceptional performance and reliability for a wide range of applications. With their ceramic-filled, glass-reinforced hydrocarbon composition, RO4534 laminates provide low loss, low dielectric constant, and excellent dimensional stability.

Substrates Introduction RO4534 substrates are composed of Rogers' specially engineered ceramic-filled, glass-reinforced hydrocarbon laminates. The key specifications include: Dielectric Constant (DK): 3.4 at 10GHz Dissipation Factor: 0.0027 at 10GHz PIM (typical) value: -157 dBC X axis CTE: 11ppm/°C, Y axis CTE: 14ppm/°C, Z axis CTE: 46ppm/°C Tg (Glass Transition Temperature): >280 °C Operating Temperature Range: -40℃ to +85℃

Substrates Features and Benefits RO4534 substrates offer numerous advantages for various applications: Low loss, low dielectric constant, and low PIM response for a wide range of applications Thermoset resin system compatible with standard PCB fabrication processes Excellent dimensional stability for greater yield on larger panel sizes Uniform mechanical properties for maintaining mechanical form during handling High thermal conductivity for improved power handling

PCB Stackup This RO4534 PCB is used in 2-layer rigid PCB stackups with the following configuration: Copper_layer_1: 35 μm Rogers 4534 Core: 0.508 mm Copper_layer_2: 35 μm

PCB Construction Details The construction details of this RO4534 PCB are as follows: Board dimensions: 169.1mm x 156.85mm = 2PCS, +/- 0.15mm Minimum Trace/Space: 5/5 mils Minimum Hole Size: 0.5mm No blind vias Finished board thickness: 0.6mm Finished Cu weight: 1oz (1.4 mils) outer layers Via plating thickness: 20 μm Surface finish: Immersion Gold Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: No Bottom Solder Mask: No 100% Electrical test used prior to shipment

PCB Statistics This RO4534 PCB demonstrates the following statistics: Components: 115 Total Pads: 223 Thru Hole Pads: 121 Top SMT Pads: 102 Bottom SMT Pads: 0 Vias: 267 Nets: 6

Type of Artwork Supplied RO4534 PCB utilizes Gerber RS-274-X artwork format.

Quality Standard RO4534 PCBs comply with the IPC-Class-2 quality standard.

Availability Our RO4534 PCBs are available worldwide, ensuring accessibility for various industries and markets.

Typical Applications RO4534 PCBs find applications in numerous industries, including: Cellular infrastructure base station antennas WiMAX antenna networks

Parameter	Value
PCB Substrates	Rogers RO4534 Ceramic-filled, Glass-reinforced Hydrocarbon Laminates
	Dielectric Constant (DK): 3.4 at 10GHz
	Dissipation Factor: 0.0027 at 10GHz
	PIM (typical) value: -157 dBC
	X axis CTE: 11ppm/°C, Y axis CTE: 14ppm/°C, Z axis CTE: 46ppm/°C
	Tg >280 °C
	-40℃?to +85℃?operation
Features and Benefits	Low Loss, Low Dk and low PIM response for wide range of application use
	Thermoset resin system compatible with standard PCB fabrication
	Excellent dimensional stability for greater yield on larger panels sizes
	Uniform mechanical properties for maintaining mechanical form during handling
	High thermal conductivity for improved power handling
Stackup	2-layer rigid PCB
	Copper_layer_1 - 35 μm
	Rogers 4534 Core - 0.508 mm
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 169.1mm x 156.85 mm = 2PCS, +/- 0.15mm
	Minimum Trace/Space: 5/5 mils
	Minimum Hole Size: 0.5mm
	No Blind vias
	Finished board thickness: 0.6mm
	Finished Cu weight: 1oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 115
	Total Pads: 223
	Thru Hole Pads: 121
	Top SMT Pads: 102
	Bottom SMT Pads: 0
	Vias: 267
	Nets: 6
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Typical Applications	Cellular infrastructure base station antennas
Typical Applications	WiMAX antenna networks

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