RO4533 PCB 20mil | Bicheng PCB

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RO4533 High Frequency PCB Built on 20mil 0.508mm Core with Double Sided Copper and Immersion Gold

Shipped: 29th-Sep-2023

This PCB is built with the Rogers RO4533, renowned for its outstanding performance. With a Dielectric Constant of DK 3.3 at 10GHz and a Dissipation Factor of 0.0025 at 10GHz, the PCB ensures low loss and low PIM response, making it suitable for a wide range of applications.

One of the key advantages of RO4533 PCB is its compatibility with standard PCB fabrication processes. The thermoset resin system ensures seamless integration into your manufacturing workflow, simplifying the production and reducing costs. Additionally, the material exhibits excellent dimensional stability, allowing for greater yield on larger panel sizes and ensuring precise and consistent results.

The uniform mechanical properties of RO4533 PCB provide enhanced form retention during handling, minimizing the risk of damage or distortion. This feature is particularly beneficial when working with complex designs or during transportation, ensuring the reliability and longevity of your PCB.

RO4533 PCB boasts high thermal conductivity, enabling improved power handling capabilities. This makes it suitable for applications that require efficient heat dissipation, ensuring optimal performance even under demanding conditions.

Now, let's explore the construction details of this 2-layer rigid PCB utilizing the advanced RO4533 material. The PCB features a copper layer thickness of 35 μm on both sides of the board. Its core has a thickness of 0.508 mm, providing structural integrity and reliable performance. With board dimensions of 185.78mm x 139.87 mm (± 0.15mm), the PCB offers ample space for your high-performance designs.

The minimum Trace/Space of 5/6 mils allows for precise routing, ensuring signal integrity and minimizing crosstalk. The minimum Hole Size of 0.4mm provides versatility in component mounting. The finished board thickness is 0.6mm, offering a compact and lightweight solution for your applications.

To ensure optimal performance and reliability, our PCB undergoes a comprehensive 100% electrical test prior to shipment. This guarantees that each board meets our high-quality standards and performs flawlessly in your application. The surface finish of Immersion Gold enhances the solderability and durability of the PCB.

The PCB Statistics for this particular design include 106 components, with a total of 230 pads. Among the pads, there are 132 thru-hole pads and 98 top SMT pads. The PCB features 249 vias and 4 nets, providing the necessary connectivity for your circuitry.

Our PCB board adheres to the widely accepted Gerber RS-274-X artwork standard and meets the stringent IPC-Class-2 quality standard. This ensures reliable performance and compliance with industry requirements. Our PCB is available worldwide, allowing customers across the globe to access its advanced features and benefits.

The versatility of RO4533 PCB makes it suitable for various applications. It excels in cellular infrastructure base station antennas and WiMAX antenna networks, delivering exceptional performance and reliability in these critical communication systems.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bichengp-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific PCB design requirements. Choose advanced PCB Material and unlock the potential of your high-performance applications.

Item	Value
PCB Material	- Rogers RO4533 Ceramic-filled, Glass-reinforced Hydrocarbon Laminates
	- Dielectric Constant at 10 GHz: 3.3
	- Dissipation Factor at 10 GHz: 0.0025
	- X-axis CTE: 13 ppm/°C
	- Y-axis CTE: 11 ppm/°C
	- Z-axis CTE: 37 ppm/°C
	- Tg: >280 °C
	- Operating Temperature: -40℃?to +85℃
Features and Benefits	- Low Loss, Low Dk and low PIM response for a wide range of application use
	- Thermoset resin system compatible with standard PCB fabrication
	- Excellent dimensional stability for greater yield on larger panel sizes
	- Uniform mechanical properties for maintaining mechanical form during handling
	- High thermal conductivity for improved power handling
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm
	Rogers 4533 Core: 0.508 mm
	Copper_layer_2: 35 μm
Construction Details	Board Dimensions: 185.78 mm x 139.87 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 5/6 mils
	Minimum Hole Size: 0.4 mm
	No Blind Vias
	Finished Board Thickness: 0.6 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 20 μm
	Surface Finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 106
	Total Pads: 230
	Thru Hole Pads: 132
	Top SMT Pads: 98
	Bottom SMT Pads: 0
	Vias: 249
	Nets: 4
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- Cellular infrastructure base station antennas
Some Typical Applications	- WiMAX antenna networks

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