Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4533 High Frequency PCB 2-layer 30mil

Shipped: 26th-MAR-2024  

1. Introduction of RO4533
Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 
RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards.
 
The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces
stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.
 
2. Features
- Dielectric Constant of DK 3.3 at 10GHz
- Dissipation Factor of 0.0025 at 10GHz
- X axis CTE of 13ppm/°C, Y CTE of 11ppm/°C, Z CTE of 37ppm/°C
- Tg >280 °C
- Low moisture absorption of 0.02%
- Thermal conductivity of 0.6 W/mk
 
3. Benefits:
- Low Loss, Low Dk and low PIM response for wide range of application use
- Thermoset resin system compatible with standard PCB fabrication
- Excellent dimensional stability for greater yield on larger panels sizes
- Uniform mechanical properties for maintaining mechanical form during handling
- High thermal conductivity for improved power handling
 
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4533 Core - 0.762 mm (30mil)
Copper_layer_2 - 35 μm
 
5. PCB Construction details:
- Board dimensions: 85.89mm x 161.45 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
 
6. PCB Statistics:
Components: 57
Total Pads: 137
Thru Hole Pads: 92
Top SMT Pads: 45
Bottom SMT Pads: 0
Vias: 102
Nets: 3
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide
10. Some Typical Applications:
- Cellular infrastructure base station antennas
- WiMAX antenna networks
  PCBBACK TO MARCH
　

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