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RO4350B PCB 2-layer 6.5mm Thick

Shipped: 16th-July-2024

1.1 Introduction of RO4350B
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.

RO4350B material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4350B material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.

1.2 Introduction of RO4450F
The RO4450F bondply is comprised of several grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with RO4000 laminates. A high postcure Tg makes RO4450F bondply an excellent choice for multi-layers requiring sequential laminations as fully cured RO4450F bondplys are capable of handling multiple lamination cycles.

In addition, FR-4 compatible bond requirements permit RO4450F bondply and low flow FR-4 bondply to be combined into non-homogeneous multi-layer constructions using a single bond cycle.

RO4450F bondply has demonstrated improvement in lateral flow capability and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements.

2.1. Features of RO4350B
- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%

2.2 Features of RO4450F
- Dielectric Constant of DK 3.52 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.004 at 10GHz/23°C
- Thermal Conductivity 0.65 W/m/°K
- X axis CTE of 19 ppm/°C, Y CTE of 17 ppm/°C, Z CTE of 50 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.09%

3. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4350B Core - 1.524 mm (60mil)
Prepreg Bond-ply - RO4450F -0.101mm (4mil)
Rogers RO4350B Core - 1.524 mm (60mil)
Prepreg Bond-ply - RO4450F -0.101mm (4mil)
Rogers RO4350B Core - 1.524 mm (60mil)
Prepreg Bond-ply - RO4450F -0.101mm (4mil)
Rogers RO4350B Core - 1.524 mm (60mil)
Copper_layer_2 - 35 μm

4. PCB Construction details:
- Board dimensions: 65mm x 65 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/8 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 6.5mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: ENIG
- Top Silkscreen: Yellow
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

5. Type of artwork supplied: Gerber RS-274-X

6. Quality standard: IPC-Class-2

7. Availability: worldwide

8. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

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