RO4350B PCB 30mil | Bicheng PCB

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RO4350B High Frequency PCB Built on 30mil 0.762mm Substrates

Shipped: 16th-Oct-2023

It’s happy to share our latest delivery of a type of cutting-edge RO4350B High Frequency PCB. Built on 30mil (0.762mm) substrates, the PCB is meticulously designed to meet the most demanding requirements, delivering excellent electrical properties, stability, and thermal conductivity.

Substrates Introduction RO4350B substrates are composed of Rogers' specially engineered woven glass reinforced hydrocarbon/ceramics material. The key specifications include: Dielectric Constant (DK): 3.48 +/- 0.05 at 10GHz Dissipation Factor: 0.0037 at 10GHz Thermal Conductivity: 0.69 W/m/°K X axis CTE: 10ppm/°C, Y axis CTE: 12ppm/°C, Z axis CTE: 32ppm/°C Tg (Glass Transition Temperature): >280 °C Operating Temperature Range: -40℃ to +85℃

Substrates Features and Benefits RO4350B substrates offer numerous advantages for various applications: Low dielectric tolerance and low loss Excellent electrical performance Enables applications with higher operating frequencies Ideal for broadband applications Stable electrical properties versus frequency Facilitates controlled impedance transmission lines Allows for repeatable design of filters Low thermal coefficient of dielectric constant Excellent dimensional stability Low Z-axis expansion Reliable plated through holes Low in-plane expansion coefficient Remains stable over an entire range of circuit processing temperatures Supports volume manufacturing process at competitive pricing CAF (Conductive Anodic Filament) resistant

PCB Stackup This RO4350B PCB is used in 2-layer rigid PCB stackups with the following configuration: Copper_layer_1: 35 μm Rogers 4350B Core: 0.762 mm (30mil) Copper_layer_2: 35 μm

PCB Construction Details The construction details of this RO4350B PCB are as follows: Board dimensions: 100mm x 50 mm = 1PCS, +/- 0.15mm Minimum Trace/Space: 4/4 mils Minimum Hole Size: 0.25mm No blind vias Finished board thickness: 0.8mm Finished Cu weight: 1oz (1.4 mils) outer layers Via plating thickness: 20 μm Surface finish: HASL (Hot Air Solder Leveling) Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: Green Bottom Solder Mask: No 100% Electrical test used prior to shipment PCB Statistics: This RO4350B PCB demonstrates the following statistics: Components: 56 Total Pads: 141 Thru Hole Pads: 81 Top SMT Pads: 60 Bottom SMT Pads: 0 Vias: 142 Nets: 4

Type of Artwork Supplied RO4350B PCB substrates utilize Gerber RS-274-X artwork format.

Quality Standard RO4350B PCB substrates comply with the IPC-Class-2 quality standard.

Availability Our RO4350B PCB are available worldwide, ensuring accessibility for various industries and markets.

Typical Applications RO4350B PCBs find applications in numerous industries, including:

Cellular base station antennas and power amplifiers RF identification tags Automotive radar and sensors LNBs (Low Noise Block) for direct broadcast satellites

Parameter	Value
PCB Substrates	Rogers RO4350B woven glass reinforced hydrocarbon/ceramics
	Dielectric Constant (DK): 3.48 +/- 0.05 at 10GHz
	Dissipation Factor: 0.0037 at 10GHz
	Thermal Conductivity: 0.69 W/m/°K
	X axis CTE: 10ppm/°C
	Y axis CTE: 12ppm/°C
	Z axis CTE: 32ppm/°C
	Tg: >280 °C
	Operating Temperature: -40℃?to +85℃
Features and Benefits	Low dielectric tolerance and low loss
	Excellent electrical performance
	Allows applications with higher operating frequencies
	Ideal for broadband applications
	Stable electrical properties vs. frequency
	Controlled impedance transmission lines
	Repeatable design of filters
	Low thermal coefficient of dielectric constant
	Excellent dimensional stability
	Low Z-axis expansion
	Reliable plated through holes
	Low in-plane expansion coefficient
	Remains stable over an entire range of circuit processing temperatures
	Volume manufacturing process (Competitively priced)
	CAF resistant
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm
	Rogers 4350B Core: 0.762 mm (30mil)
	Copper_layer_2: 35 μm
Construction Details	Board dimensions: 100mm x 50mm = 1PCS, +/- 0.15mm
	Minimum Trace/Space: 4/4 mils
	Minimum Hole Size: 0.25mm
	No blind vias
	Finished board thickness: 0.8mm
	Finished Cu weight: 1oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: HASL
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 56
	Total Pads: 141
	Thru Hole Pads: 81
	Top SMT Pads: 60
	Bottom SMT Pads: 0
	Vias: 142
	Nets: 4
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	Cellular Base Station Antennas and Power Amplifiers
	RF Identification Tags
	Automotive Radar and Sensors
	LNB's for Direct Broadcast Satellites

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