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RO4350B High Frequency PCB 2-layer 30mil

Shipped: 25th-MAR-2024

1. Introduction of RO4350B

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.

RO4350B material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4350B material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.

2. Features

- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%

3. Benefits:

- Ideal for multi-layer board (MLB) constructions
- Processes like FR-4 at lower fabrication cost
- Excellent dimensional stability
- Competitively priced

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.762 mm (30mil)
Copper_layer_2 - 20 μm

5. PCB Construction details:

- Board dimensions: 53.18mm x 76.04 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:

Components: 12
Total Pads: 65
Thru Hole Pads: 33
Top SMT Pads: 32
Bottom SMT Pads: 0
Vias: 31
Nets: 3

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:

- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

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