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RO4350B High Frequency PCB
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Introduction |
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Hello Everyone, |
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Today, we’re going to talk about high frequency PCB built on RO4350B laminates. |
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Rogers' RO4350B materials are a proprietary blend of woven glass reinforced hydrocarbon/ceramics. They offer electrical performance that closely resembles PTFE/woven glass, while also providing the manufacturability advantages of epoxy/glass. |
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The RO4350B laminates offer precise control over the dielectric constant (Dk) and maintain low loss characteristics. They can be processed using the same methods as standard epoxy/glass laminates. Moreover, these laminates are available at a significantly lower cost compared to traditional microwave laminates, making them more cost-effective. |
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A notable advantage of RO4350B laminates is that they eliminate the need for special through-hole treatments or handling procedures typically required for PTFE-based materials. This simplifies the manufacturing process and reduces associated costs and complexity. |
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Additionally, these materials have obtained a UL 94 V-0 rating, ensuring their suitability for applications involving active devices and high-power RF designs. This rating signifies their compliance with stringent safety standards. |
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Data sheets |
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RO4350B is a high-performance substrate widely used in the field of electronics and telecommunications. With its exceptional electrical and mechanical properties, RO4350B has become a popular choice for various applications. This paragraph provides a comprehensive overview of the typical values associated with RO4350B, shedding light on its key characteristics and performance metrics. |
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Dielectric Constant: A Crucial Parameter |
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The dielectric constant, represented by ε, is an essential property of RO4350B. The process dielectric constant (εProcess) is measured at 3.48±0.05, ensuring reliable signal transmission. Additionally, the design dielectric constant (εDesign) is determined to be 3.66, making RO4350B suitable for a wide frequency range of 8 to 40 GHz. These values were obtained using the IPC-TM-650 2.5.5.5 Clamped Stripline test method for εProcess and the Differential Phase Length Method for εDesign. |
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Dissipation Factor: Minimizing Signal Loss |
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RO4350B exhibits a low dissipation factor, indicating minimal signal loss during transmission. At 10 GHz/23℃, the dissipation factor (tan,δ) is measured to be 0.0037, while at 2.5 GHz/23℃, it is found to be 0.0031. These values were determined using the IPC-TM-650 2.5.5.5 test method, highlighting the excellent performance of RO4350B in maintaining signal integrity. |
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Thermal Coefficient of Dielectric Constant: Stability Across Temperature Variations |
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One of the notable features of RO4350B is its stability across temperature variations. The thermal coefficient of the dielectric constant (+50 ppm/℃) ensures that the material maintains its electrical properties even in extreme temperature conditions ranging from -50℃ to 150℃. The measurement was carried out using the IPC-TM-650 2.5.5.5 test method, providing valuable insights into the material's behavior under varying thermal conditions. |
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Electrical and Mechanical Strength: Robust Performance |
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RO4350B demonstrates remarkable electrical and mechanical strength, making it suitable for demanding applications. The volume resistivity is measured at 1.2 x 10^10 MΩ.cm (COND A), ensuring excellent insulation properties. The surface resistivity is determined to be 5.7 x 10^9 MΩ (COND A), further enhancing its electrical performance. Additionally, the material exhibits an impressive electrical strength of 31.2 kV/mm (780 v/mil) at a thickness of 0.51mm (0.020"), as per the IPC-TM-650 2.5.6.2 test method. |
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Mechanical properties are equally important, and RO4350B excels in this regard as well. The tensile modulus is measured at 16,767 MPa (2,432 ksi) in the X-direction and 14,153 MPa (2,053 ksi) in the Y-direction, as per the ASTM D 638 test method. The material demonstrates good tensile strength, with values of 203 MPa (29.5 ksi) in the X-direction and 130 MPa (18.9 ksi) in the Y-direction. Additionally, the flexural strength is determined to be 255 MPa (37 kpsi) using the IPC-TM-650 2.4.4 test method. |
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Dimensional Stability and Thermal Expansion: Precision and Reliability |
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RO4350B exhibits exceptional dimensional stability, ensuring precise and reliable performance. The material showcases dimensional stability of less than 0.5 mm/m (mil/inch) after etching and exposure to E2/150℃, as determined by the IPC-TM-650 2.4.39A test method. Moreover, the coefficient of thermal expansion is measured at 10 ppm/℃ (X-direction), 12 ppm/℃ (Y-direction), and 32 ppm/℃ (Z-direction) across a wide temperature range of -55℃ to 288℃, as per the IPC-TM-650 2.4.41 test method. |
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Additional Properties: Versatility and Compatibility |
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RO4350B offers several additional properties that enhance its versatility and applicability. With a glass transition temperature (Tg) exceeding 280℃ (TMA), the material remains stable even at high temperatures. The decomposition temperature (Td) is measured at 390℃ (TGA), indicating superior thermal stability. Furthermore, RO4350B demonstrates a thermal conductivity of 0.69 W/M/oK at 80℃, as per the ASTM C518 test method. |
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The material's moisture absorption is minimal, with a value of 0.06% after 48 hours of immersionat 50℃. It boasts a density of 1.86 gm/cm3 at 23℃, contributing to its lightweight nature. Additionally, RO4350B exhibits a copper peel strength of 0.88 N/mm (5.0 pli) after solder float with 1 oz. EDC Foil, ensuring reliable bonding in electronic applications. It meets the UL 94 V-0 flammability rating, providing a high level of fire resistance. Moreover, RO4350B is compatible with lead-free processes, aligning with modern environmental regulations. |
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RO4350B Typical Value |
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255
(37) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃?TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
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℃?TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.69 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.86 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88
(5.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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PCB Capability (RO4350B) |
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We take pride in offering a wide range of capabilities to meet your specific PCB requirements. Our state-of-the-art facilities and skilled team enable us to deliver high-quality RO4350B printed circuit boards (PCBs) with various layer counts, copper weights, laminate thicknesses, sizes, solder mask colors, and surface finishes. This section provides an overview of our PCB capabilities, highlighting our expertise in accommodating your unique specifications. |
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Layer Count: Single Layer, Double Layer, Multi-layer, Hybrid Designs |
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We specialize in manufacturing PCBs with different layer counts to suit your specific needs. Whether you require simple single-layer boards or complex multi-layer designs, our capabilities cover a wide range. We can also accommodate hybrid designs, combining different layer configurations to meet specific requirements. Our skilled technicians ensure precise layer alignment and reliable interconnectivity for optimal performance. |
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Copper Weight: 1oz (35µm), 2oz (70µm) |
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Our capabilities include the use of different copper weights to meet your specific electrical and thermal requirements. We can manufacture PCBs with copper weights of 1oz (35µm) and 2oz (70µm). The choice of copper weight depends on the desired current-carrying capacity, thermal dissipation needs, and overall design considerations. |
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Laminate Thickness: 4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
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We offer a range of laminate thickness options to cater to your specific PCB requirements. Our capabilities include laminate thicknesses of 4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm). The selection of laminate thickness depends on factors such as the mechanical strength needed, layer count, and overall board thickness considerations. |
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PCB Size: ≤400mm X 500mm |
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Our capabilities cover a maximum PCB size of 400mm X 500mm. Whether you require smaller or larger boards, we can accommodate a wide range of sizes. Our manufacturing processes ensure precise dimensional accuracy and consistency, regardless of the PCB size, to meet your specific application requirements. |
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Solder Mask: Green, Black, Blue, Yellow, Red, etc. |
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We offer a variety of solder mask color options to suit your preferences and application needs. Our capabilities include solder masks in popular colors such as green, black, blue, yellow, red, and more. The choice of solder mask color can be customized to align with your branding or visual requirements. |
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Surface Finish: Bare Copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP, ENEPIG, Pure gold, etc. |
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We provide a range of surface finish options to ensure optimal performance and protection for your PCBs. Our capabilities include various surface finishes such as bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), immersion silver, immersion tin, OSP (Organic Solderability Preservative), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), pure gold, and more. The choice of surface finish depends on factors like solderability, conductivity, environmental considerations, and compatibility with specific assembly processes. |
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Our PCB Capability (RO4350B) |
PCB Material: |
Glass reinforced hydrocarbon ceramic laminates |
Designator: |
Rogers RO4350B |
Dielectric constant: |
3.48 ±0.05 (process) |
3.65 (design) |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid Designs |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP, ENEPIG, Pure gold etc. |
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Multi-layer PCB |
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RO4350B laminates are frequently utilized in the production of multi-layer PCBs. The most straightforward approach involves constructing the multi-layer boards on distinct cores and subsequently merging them using a bonding ply material known as RO4450F. |
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Hybrid PCB |
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To minimize production costs while maintaining signal integrity in high-frequency environments, one approach is to combine RO4350B with FR-4 epoxy glass substrates. The high-frequency material is employed in the signal layer, while FR-4 is utilized in the remaining track layers. |
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A piece of RO4350B PCB |
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On the screen, we have observed a specific type of RO4350B PCB with a thickness of 60mil, featuring an immersion gold surface finish. This particular PCB is designed for use in microwave power amplifiers. |
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Applications |
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RO4350B PCBs find extensive application in various industries. Some typical applications include:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites |
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