Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO4003C Multilayer High Frequency PCB Via Copper Filled

Shipped: 26th-JAN-2024  

1. RO4003C Introduction
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

RO4003C laminates are currently offered in various configurations utilizing both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.
RO4003C materials are non-brominated and are not UL 94 V-0 rated.
2. Features
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- Thermal Conductivity 0.71 W/m/°K
- X axis CTE of 11 ppm/°C, Y CTE of 14 ppm/°C, Z CTE of 46 ppm/°C
- High Tg value of >280 °C
3. Benefits:
- Ideal for multi-layer board (MLB) constructions
- Processes like FR-4 at lower fabrication cost
- Designed for performance sensitive, high volume applications
- Competitively priced
4. PCB Stackup: 3-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4003C Core - 0.508 mm (20mil)
Prepreg RO4450F -0.200mm
Copper_layer_2 - 35 μm
Rogers RO4003C Core - 1.524mm
Prepreg RO4450F - 0.200mm
Rogers RO4003C Core - 1.524mm
Prepreg RO4450F -0.200mm
Rogers RO4003C Core - 0.508mm
Copper_layer_3- 35μm
5. PCB Construction details:
- Board dimensions: 66mm x 66 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 10/10 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 4.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: ENEPIG
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- plugged via filled with conductive paste(copper paste)
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 2
Total Pads: 5
Thru Hole Pads: 3
Top SMT Pads: 2
Bottom SMT Pads: 0
Vias: 1
Nets: 1
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
 
 
 
 
 
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