Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO4003C RF PCB 4-layer 0.7mm Thick

Shipped: 14th-June-2024  

1. Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.
RO4003C materials are non-brominated and are not UL 94 V-0 rated.
2. Features
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- Thermal Conductivity of 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C
- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C
- Low Z-axis coefficient of thermal expansion at 46 ppm/°C
- Tg >280 °C
- Low Moisture Absorption of 0.06%
3. Benefits:
- Ideal for multi-layer board (MLB) constructions
- Processes like FR-4 at lower fabrication cost
- Designed for performance sensitive, high volume applications
-Competitively priced
4. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm
RO4450F Bondply - 0.101 mm (4mil) *
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 112mm x 121 mm=2 Types=2PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.7mm
- Finished Cu weight: 1oz (1.4 mils) outer layers, 1oz (1.4 mils) inner layers
- Via plating thickness: 20 μm
- Surface finish: ENIG
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 16
Total Pads: 35
Thru Hole Pads: 24
Top SMT Pads: 11
Bottom SMT Pads: 0
Vias: 18
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide
10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
* RO4450F Bondply
The RO4450F bondply is comprised of several grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with RO4000 laminates. A high postcure Tg makes RO4450F bondply an excellent choice for multi-layers requiring sequential laminations as fully cured RO4450F bondplys are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements permit RO4450F bondply and low flow FR-4 bondply to be combined into non-homogeneous multi-layer constructions using a single bond cycle.
RO4450F bondply has demonstrated improvement in lateral flow capability and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements.
  PCBBACK TO JUNE
　

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