RO4003C PCB 20mil| Bicheng PCB

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RO4003C High Frequency PCB Built on 20mil 0.508mm Laminates with Double Sided Copper and HASL Finish

Shipped: 22nd-Sep-2023

Introducing our high-performance PCB board, Rogers RO4003C RF PCB. Engineered with precision and reliability, this material is designed to meet the demands of performance-sensitive, high-volume applications. With its exceptional electrical properties and stability, RO4003C is the ideal choice for applications requiring low dielectric tolerance and low loss.

The RO4003C PCB Material features a hydrocarbon ceramic woven glass construction, providing excellent dimensional stability and reliable performance. With a Dielectric Constant (DK) of 3.38 at 10 GHz and a Dissipation Factor of 0.0027 at 10 GHz, this material ensures exceptional electrical performance, making it suitable for applications operating at higher frequencies. Its stable electrical properties across a wide frequency range allow for controlled impedance transmission lines and repeatable design of filters.

Engineered with low thermal coefficient of dielectric constant, RO4003C offers excellent thermal stability and dimensional control. This ensures reliable performance over a wide range of circuit processing temperatures, making it ideal for demanding applications. The low Z-axis expansion of the material guarantees reliable plated-through holes, further enhancing the overall reliability of your PCB.

Manufacturing with RO4003C is made easy as it can be processed using standard glass epoxy techniques, providing a volume manufacturing process. This allows for cost-effective production without compromising on performance. Additionally, the material is CAF (Conductive Anodic Filament) resistant, ensuring long-term reliability and protection against electrical failures.

This 2-layer rigid PCB using RO4003C features a stackup with copper_layer_1 (35 μm or 1oz), Rogers 4003C Core with a thickness of 20mil (0.508mm), and copper_layer_2 (35 μm or 1oz). This construction ensures optimal signal integrity and reliability for your designs.

With a compact board dimension of 65mm x 45mm (± 0.15mm), you have a space-efficient solution for your applications. Achieve intricate and precise designs with a minimum Trace/Space of 4/4 mils. The minimum Hole Size of 0.35mm provides versatility for component mounting. The absence of Blind vias simplifies the manufacturing process. With a finished board thickness of 0.6mm, our RO4003C PCB strikes a balance between durability and space efficiency. The outer layers feature a finished Cu weight of 1oz (1.4 mils), ensuring excellent conductivity. Reliable electrical connections are guaranteed with via plating thickness of 25 μm. The surface finish of Hot Air Soldering Level (HASL) provides a reliable solderable surface. The absence of Top and Bottom Silkscreen and Solder Masks contributes to a clean and sleek appearance. Each RO4003C PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

Rest assured, our RO4003C PCB adheres to the widely accepted Gerber RS-274-X artwork standard. It also meets the stringent IPC-Class-2 quality standard, ensuring reliable performance and compliance with industry requirements. With worldwide availability, you can access the advanced features and benefits of the RO4003C PCB no matter where you are located.

The RO4003C PCB Material finds its applications in various industries, including Cellular Base Station Antennas and Power Amplifiers, RF Identification Tags, Automotive Radar and Sensors, and LNBs for Direct Broadcast Satellites. Its exceptional electrical performance, stability, and reliability make it the ideal choice for demanding RF and high-frequency applications.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific PCB design requirements.

Item	Value
PCB Material	Rogers RO4003C Hydrocarbon Ceramic Woven Glass
	Dielectric Constant (Dk) at 10 GHz: 3.38
	Dissipation Factor at 10 GHz: 0.0027
	Tg: >280 °C
	Td: >425 °C
	-40°C to +85°C operation
Features and Benefits	A) Reinforced hydrocarbon/ceramic laminates
	- Designed for performance-sensitive, high-volume applications
	B) Low dielectric tolerance and low loss
	- Excellent electrical performance
	- Allows applications with higher operating frequencies
	- Ideal for broadband applications
	C) Stable electrical properties vs. frequency
	- Controlled impedance transmission lines
	- Repeatable design of filters
	D) Low thermal coefficient of dielectric constant
	- Excellent dimensional stability
	E) Low Z-axis expansion
	- Reliable plated through holes
	F) Low in-plane expansion coefficient
	- Remains stable over an entire range of circuit processing temperatures
	G) Volume manufacturing process
	- RO4000 laminates can be fabricated using standard glass epoxy processes
	- Competitively priced
	H) CAF resistant
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm (1oz)
	Rogers 4003C Core: 20 mil (0.508 mm)
	Copper_layer_2: 35 μm (1oz)
Construction Details	Board Dimensions: 65 mm x 45 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 4/4 mils
	Minimum Hole Size: 0.35 mm
	No Blind Vias
	Finished Board Thickness: 0.6 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 25 μm
	Surface Finish: Hot Air Soldering Level (HASL)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 16
	Total Pads: 56
	Thru Hole Pads: 35
	Top SMT Pads: 21
	Bottom SMT Pads: 0
	Vias: 61
	Nets: 4
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- Cellular Base Station Antennas and Power Amplifiers
	- RF Identification Tags
	- Automotive Radar and Sensors
	- LNB's for Direct Broadcast Satellites

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