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RO4003C High Frequency PCB 2-Layer 8mil

Shipped: 20th-MAR-2024

1. Introduction of RO4003C

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

RO4003C materials are non-brominated and are not UL 94 V-0 rated.

RO4003C material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4003C material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.

2. Features

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.
- Thermal Coefficient of dielectric constant of +40 ppm/°C
- Thermal Conductivity 0.71 W/m/°K
- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C
- Low moisture absorption of 0.06%

3. Benefits:

- Ideal for multi-layer board (MLB) constructions
- Processes like FR-4 at lower fabrication cost
- Designed for performance sensitive, high volume applications
- Competitively priced

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:

- Board dimensions: 28.33mm x 167.16 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 0.3mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: Black
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:

Components: 21
Total Pads: 63
Thru Hole Pads: 34
Top SMT Pads: 29
Bottom SMT Pads: 0
Vias: 79
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:

- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

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