RO4003C PCB 60mil | Bicheng PCB

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RO4003C High Frequency PCB Built on 60mil 1.524mm Substrate

Shipped: 23rd-Oct-2023

We are pleased to introduce our RO4003C High Frequency PCB, built on a 60mil (1.524mm) substrate.This advanced PCB is designed to meet the demanding requirements of high-frequency applications, offering exceptional signal integrity and performance.

Substrates Introduction RO4003C is a woven glass reinforced hydrocarbon/ceramic material that offers exceptional performance for high-frequency applications. It boasts a dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, ensuring reliable signal transmission. With a dissipation factor of 0.0027 at 10GHz, RO4003C minimizes energy loss during signal propagation. Its thermal conductivity of 0.71 W/m/°K helps dissipate heat effectively, ensuring optimal performance. Moreover, RO4003C exhibits a low coefficient of thermal expansion (CTE), with X, Y, and Z axes measuring 11ppm/°C, 14ppm/°C, and 46ppm/°C, respectively. This makes it suitable for a wide temperature range, from -40℃ to +85℃.

Substrates Features and Benefits RO4003C offers numerous advantages for high-frequency applications. Its low dielectric tolerance and low loss characteristics make it an excellent choice for minimizing signal distortion. The substrate enables outstanding electrical performance, allowing for applications with higher operating frequencies. RO4003C ensures stable electrical properties across a range of frequencies and supports controlled impedance transmission lines. It facilitates the repeatable design of filters while maintaining a low thermal coefficient of dielectric constant. Furthermore, RO4003C exhibits excellent dimensional stability, low Z-axis expansion, and reliable plated through holes. It remains stable over a wide range of circuit processing temperatures, making it highly reliable. The substrate can be manufactured in large volumes using standard glass epoxy processes, offering a cost-effective solution. Lastly, RO4003C is resistant to conductive anodic filamentation (CAF), ensuring long-term durability.

PCB Stackup The stackup for this RO4003C is a 2-layer rigid PCB. It consists of a copper layer with a thickness of 35 μm, followed by a Rogers 4003C core with a thickness of 1.524 mm (60mil), and another copper layer with a thickness of 35 μm.

PCB Construction Details RO4003C PCBs are known for their precise construction and reliability. This board has a dimension of 140mm x 144mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 5/4 mils, ensuring intricate circuitry. The minimum hole size is 0.4mm, allowing for efficient component placement. These PCBs do not include blind vias. The finished board thickness is 1.6mm, providing stability and durability. With a finished copper weight of 1oz (1.4 mils) on the outer layers, the PCB ensures optimal conductivity. The via plating thickness is 20 μm, enhancing connectivity. The surface finish is immersion gold, offering excellent solderability and corrosion resistance. The PCBs do not have top or bottom silkscreen or solder mask. Additionally, each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring functionality.

PCB Statistics This RO4003C PCB exhibits the following statistics: They consist of 58 components and feature a total of 173 pads. Among these, 103 are thru-hole pads, while 70 are top SMT pads. There are no bottom SMT pads. The PCBs incorporate 114 vias, ensuring efficient signal routing. With 6 nets, the PCBs support complex circuit designs.

Artwork Supplied and Quality Standard RO4003C PCBs are supplied with Gerber RS-274-X artwork, a widely used format for PCB manufacturing. These PCBs adhere to the IPC-Class-2 quality standard, ensuring high-quality production.

Availability: Our RO4003C PCBs are available worldwide, making them accessible for various industrial applications.

Typical Applications RO4003C PCBs find application in diverse industries. They are commonly used in cellular base station antennas and power amplifiers, providing reliable signal transmission. RO4003C PCB is also suitable for RF identification tags, enabling efficient communication. In automotive applications, such as radar and sensors, RO4003C ensures accurate data processing. Additionally, it is employed in the manufacture of LNBs (Low Noise Blockdown Converters) for direct broadcast satellites, ensuring high-performance signal reception.

Parameter	Value
PCB Substrates	Rogers RO4003C woven glass reinforced hydrocarbon/ceramics
	Dielectric Constant (DK): 3.38 +/- 0.05 at 10GHz
	Dissipation Factor: 0.0027 at 10GHz
	Thermal Conductivity: 0.71 W/m/°K
	X axis CTE: 11ppm/°C
	Y axis CTE: 14ppm/°C
	Z axis CTE: 46ppm/°C
	Tg: >280 °C
	Operating Temperature: -40℃?to +85℃
Features and Benefits	Low dielectric tolerance and low loss
	Excellent electrical performance
	Allows applications with higher operating frequencies
	Ideal for broadband applications
	Stable electrical properties vs. frequency
	Controlled impedance transmission lines
	Repeatable design of filters
	Low thermal coefficient of dielectric constant
	Excellent dimensional stability
	Low Z-axis expansion
	Reliable plated through holes
	Low in-plane expansion coefficient
	Remains stable over an entire range of circuit processing temperatures
	Volume manufacturing process (Competitively priced)
	CAF resistant
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm
	Rogers 4003C Core: 1.524 mm (60mil)
	Copper_layer_2: 35 μm
Construction Details	Board dimensions: 140mm x 144mm = 1PCS, +/- 0.15mm
	Minimum Trace/Space: 5/4 mils<br>- Minimum Hole Size: 0.4mm
	No Blind vias
	Finished board thickness: 1.6mm
	Finished Cu weight: 1oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 58
	Total Pads: 173
	Thru Hole Pads: 103
	Top SMT Pads: 70
	Bottom SMT Pads: 0
	Vias: 114
	Nets: 6
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Typical Applications	Cellular Base Station Antennas and Power Amplifiers
	RF Identification Tags
	Automotive Radar and Sensors
	LNB's for Direct Broadcast Satellites

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