RO4003C PCB 32mil| Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RO4003C High Frequency PCB Built on 32mil 0.813mm Substrate

Shipped: 14th-Oct-2023

We are thrilled to introduce our RO4003C High Frequency PCB, built on a 32mil (0.813mm) substrate. This advanced high frequency materials, manufactured by Rogers, are woven glass reinforced hydrocarbon/ceramic substrates known for their exceptional electrical performance and stability. With a dielectric constant of DK 3.38 +/- 0.05 at 10GHz and a low dissipation factor, these PCBs enable applications operating at higher frequencies.

Substrates Introduction: Exceptional Material Properties

RO4003C PCBs are composed of woven glass reinforced hydrocarbon/ceramics, offering remarkable characteristics for demanding applications. The key properties include: 1.Dielectric Constant: With a DK of 3.38 +/- 0.05 at 10GHz, RO4003C PCBs exhibit low dielectric tolerance and low loss, making them ideal for broadband applications. 2.Dissipation Factor: The low dissipation factor of 0.0027 at 10GHz ensures excellent electrical performance and stable transmission. 3.Thermal Conductivity: RO4003C PCBs demonstrate a thermal conductivity of 0.71 W/m/°K, facilitating efficient heat dissipation in high-power applications. 4.Coefficient of Thermal Expansion (CTE): The CTE values for RO4003C are X-axis: 11ppm/°C, Y-axis: 14ppm/°C, and Z-axis: 46ppm/°C, ensuring dimensional stability even under extreme temperature variations. 5.High-Temperature Operation: RO4003C PCBs can withstand a wide temperature range from -40℃ to +85℃, making them suitable for various environmental conditions.

Substrate Features and Benefits: Achieving Performance Excellence

RO4003C PCBs offer numerous features and benefits that contribute to their superior performance: 1.Stable Electrical Properties: These substrates exhibit consistent electrical properties across a wide frequency range, enabling controlled impedance transmission lines and repeatable filter designs. 2.Low Coefficient of Dielectric Constant: The low thermal coefficient of the dielectric constant ensures excellent dimensional stability, maintaining signal integrity in demanding applications. 3.Reliable Plated Through Holes: With low Z-axis expansion, RO4003C PCBs ensure reliable plated through holes, enhancing overall reliability. 4.In-Plane Expansion Coefficient: The low in-plane expansion coefficient of RO4003C PCBs remains stable during circuit processing, ensuring consistent performance across various temperatures. 5.Volume Manufacturing Process: RO4003C laminates can be fabricated using standard glass epoxy processes, allowing for cost-effective volume manufacturing. 6.CAF Resistance: These PCBs are resistant to Conductive Anodic Filament (CAF) formation, offering enhanced reliability and longevity.

PCB Stackup and Construction Details: Precision and Quality

This RO4003C PCBs are designed as 2-layer rigid boards with the following specifications: Copper Layer Thickness: Both copper layers have a thickness of 35 μm. Core Thickness: The Rogers 4003C core measures 0.813 mm (32mil), providing structural stability. Board Dimensions: The board dimensions are precisely 161.5mm x 163mm, with a tolerance of +/- 0.15mm. Minimum Trace/Space and Hole Size: The PCBs support fine trace/space requirements of 4/5 mils and a minimum hole size of 0.5mm. Surface Finish and Solder Mask: The surface finish is Immersion Gold, while the solder mask is Green on the top side and absent on the bottom side. Silkscreen: The top silkscreen is in White color, providing clear component labeling. Via Plating and Electrical Testing: Via plating thickness is 20 μm, and prior to shipment, every board undergoes a 100% electrical test to ensure quality.

PCB Statistics and Quality Standards: Precision Engineering

These RO4003C PCBs exhibit precision and reliability, as indicated by the following statistics: Components and Pads: There are 47 components with a total of 173 pads, including 92 through-hole pads and 81 surface-mount technology (SMT) pads on the top side. Vias and Nets: The PCB features 151 vias and has 5 nets, providing connectivity for complex circuitry. Artwork and Quality Standard: The supplied artwork is in Gerber RS-274-X format, and the PCBs meet the IPC-Class-2 quality standard, ensuring high manufacturing standards.

Typical Applications: Advancing Technological Frontiers

RO4003C PCBs find applications in various cutting-edge technologies, including: Cellular Base Station Antennas and Power Amplifiers: These PCBs enable efficient wireless communication systems in cellular infrastructure. RF Identification Tags: RO4003C substrates contribute to the development of precise and reliable RF identification tags used in diverse industries. Automotive Radar and Sensors: High quality RO4003C PCBs are utilized in automotive radar systems and sensors, ensuring accurate detection and reliable performance. LNB's for Direct Broadcast Satellites: These PCBs play a crucial role in the production of low-noise block down converters used in direct broadcast satellite systems, ensuring optimal signal reception.

Parameter	Value
PCB Substrates
Material	Rogers RO4003C woven glass reinforced hydrocarbon/ceramics
Dielectric Constant	DK 3.38 +/- 0.05 at 10GHz
Dissipation Factor	0.0027 at 10GHz
Thermal Conductivity	0.71 W/m/°K
CTE	X: 11ppm/°C, Y: 14ppm/°C, Z: 46ppm/°C
Tg	>280 °C
- Operating Temperature	-40℃?to +85℃
Features and Benefits	- Low dielectric tolerance
	- Excellent electrical performance
	- Applications with higher operating frequencies
	- Stable electrical properties vs. frequency
	- Controlled impedance transmission lines
	- Repeatable design of filters
	- Low thermal coefficient of dielectric constant
	- Excellent dimensional stability
	- Low Z-axis expansion
	- Reliable plated through holes
	- Low in-plane expansion coefficient
	- Remains stable over an entire range of circuit processing temperatures
	- Volume manufacturing process
	- CAF resistant
Stackup
Type	2-layer rigid PCB
- Copper Layer 1 Thickness	35 μm
- Rogers 4003C Core Thickness	0.813 mm (32mil)
- Copper Layer 2 Thickness	35 μm
PCB Construction Details
- Board Dimensions	161.5mm x 163mm (2 Types=2PCS, +/- 0.15mm)
- Minimum Trace/Space	4/5 mils
- Minimum Hole Size	0.5mm
- Blind Vias	No
- Finished Board Thickness	0.9mm
- Finished Cu Weight	1oz (1.4 mils) outer layers
- Via Plating Thickness	20 μm
- Surface Finish	Immersion Gold
- Top Silkscreen	White
- Bottom Silkscreen	No
- Top Solder Mask	Green
- Bottom Solder Mask	No
- Via Filled and Capped	0.5mm via filled and capped
- Electrical Test	100% Electrical test used prior to shipment
PCB Statistics
Components	47
Total Pads	173
Thru Hole Pads	92
Top SMT Pads	81
Bottom SMT Pads	0
Vias	151
Nets	5
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Typical Applications	- Cellular Base Station Antennas and Power Amplifiers
	- RF Identification Tags
	- Automotive Radar and Sensors
	- LNB's for Direct Broadcast Satellites

BACK TO OCTOBER