Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4003C Low Profile LoPro High Frequency PCB 2-Layer 60.7mil Thickness

Shipped: 19th-JAN-2024  

1. RO4003C Low Profile Introduction
RO4003C LoPro laminates use a proprietary Rogers’ technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining the other desirable attributes of the standard RO4003C laminate system. RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and do not require specialized via preparation such as sodium etch for lower manufacturing cost.

2. Features
- Dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C
- Dissipation factor of 0.0027 at 10 GHz/23°C
- Td> 425°C, High Tg greater than 280 °C TMA
- High Thermal Conductivity of 0.64 W/mK
- Low Z-axis coefficient of thermal expansion at 46 ppm/°C
- Copper matached Coefficient of Thermal Expansion (-55 to 288 °C):X axis 11 ppm/°C, Y axis 14 ppm/°C
- Lead free Process Compatible

3. Benefits
- Lower insertion loss allows for higher operating frequency designs (even greater than 40 GHz)
- Reduced passive inter-modulation (PIM) for base station antennas
- Improved thermal performance due to lower conductor loss
- Mulilayer PCB capability
- Design flexibility
- High temperature processing
- Meets environmental concerns
- CAF resistant
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4003C LoPro Substrate - 60.7mil (1.542mm)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 86.6mm x 90.8 mm=16PCS
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1 oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 9
Total Pads: 33
Thru Hole Pads: 21
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 11
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB’s for direct broadcast satellites
- RF Identification Tags
 
 
 
 
 
 
 
 
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