Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO3203 High Frequency PCB 2-Layer 60mil 1.524mm Laminates

Shipped: 19th-JAN-2024  

1. RO3203 Introduction
RO3203 High Frequency Circuit Materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are
engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3203 High Frequency Materials were designed as an extension of the RO3000 Series High Frequency Circuit Materials with one distinguishing characteristic - improved mechanical stability. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

2. Features
- Rogers RO3203 ceramic-filled PTFE composites
- Dielectric constant of 3.02+/- 0.04 at 10 GHz/23°C
- Dissipation factor of 0.0016 at 10 GHz/23°C
- Td> 500°C
- Thermal Conductivity of 0.87 W/mK
- Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 13 ppm/°C, Y axis 13 ppm/°C, Z axis 58 ppm/°C
- Lead free Process Compatible, 94V-0 flammability.
3. Benefits
Woven glass reinforcement
- Improves rigidity for easier handling
Uniform electrical and mechanical performance
- Ideal for complex multi-layer high frequency structures
Low dielectric loss
- High frequency performance used in applications exceeding 20 GHz
Low in-plane expansion coefficient (matched to copper)
- Suitable for use with epoxy multi-layer board hybrid designs
- Reliable surface mounted assemblies
Excellent dimensional stability
- High production yields
Economically priced
- Cost effective volume manufacturing
Surface smoothness
- Allows for finer line etching tolerances
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO3203 Substrate - 60mil (1.524mm)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 65mm x 42 mm=1PCS
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.45mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1 oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 19
Total Pads: 52
Thru Hole Pads: 37
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 24
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
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