RO3035 High Frequency Printed Circuit Board

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RO3035 High Frequency Printed Circuit Board

Introduction

Greetings, everyone,
In today's discussion, we will be focusing on high frequency PCBs constructed using Rogers RO3035 substrates.

Rogers RO3035 laminates are circuit materials with a base of PTFE (polytetrafluoroethylene) filled with ceramics. These laminates are specifically designed for commercial microwave and RF applications. They offer outstanding electrical and mechanical stability while maintaining competitive pricing. The consistent mechanical properties of RO3035 laminates allow designers to create multilayer board designs for individual layers without facing issues like warping or reliability concerns. As a result, RO3035 laminates provide effective design solutions for applications such as 5G, millimeter wave sub 6GHz, and massive MiMo (Multiple-Input Multiple-Output) technologies.

Data sheet

RO3035 is a high-performance material with various electrical, thermal, mechanical, and physical properties. Let's explore its characteristics in detail.

Starting with the electrical properties, the dielectric constant of RO3035 during the manufacturing process is 3.50 ± 0.05 in the Z direction, measured at 10 GHz and 23℃ using the IPC-TM-650 2.5.5.5 Clamped Stripline test method. For design purposes, the dielectric constant is 3.6 in the Z direction, covering a frequency range of 8 GHz to 40 GHz, determined using the Differential Phase Length Method.

The dissipation factor, also known as tan delta, is 0.0015 in the Z direction at 10 GHz and 23℃, as per the IPC-TM-650 2.5.5.5 test method. The thermal coefficient of the dielectric constant is -45 ppm/℃ in the Z direction, measured from 10 GHz and a temperature range of -50℃ to 150℃ using the IPC-TM-650 2.5.5.5 standard.

Moving to the electrical resistivity, the volume resistivity of RO3035 is 10^7 MΩ.cm, and the surface resistivity is also 10^7 MΩ, both under COND A conditions, following the IPC 2.5.17.1 test method.

In terms of thermal properties, RO3035 exhibits a decomposition temperature (Td) of 500℃, determined through thermogravimetric analysis (TGA) according to the ASTM D 3850 standard. The material has a coefficient of thermal expansion ranging from 17 ppm/℃ to 24 ppm/℃ in the X, Y, and Z directions, covering a temperature range of -55℃ to 288℃, measured at 23℃ and 50% relative humidity using the IPC-TM-650 2.4.4.1 test method. The thermal conductivity of RO3035 is 0.5 W/M/K at 50℃, tested as per ASTM D 5470.

Moving on to the mechanical properties, the copper peel strength is 10.2 Ib/in., tested with a 1oz copper layer after solder float according to the IPC-TM 2.4.8 standard. The Young's modulus, a measure of stiffness, is reported as 1025 MPa and 1006 MPa at 23℃, determined using the ASTM D 638 standard.

Considering dimensional stability, RO3035 exhibits a range of -0.11 mm/m to 0.11 mm/m in the MD (Machine Direction) and CMD (Cross-Machine Direction), respectively, under Condition A, as determined by the IPC TM-650 2.2.4 test method.

In terms of physical properties, RO3035 has a flammability rating of V-0, conforming to the UL 94 standard. The moisture absorption is reported as 0.04% as per the D48/50 test conducted according to the IPC-TM-650 2.6.2.1 standard. The density of RO3035 is 2.1 gm/cm3 at 23℃, measured using the ASTM D 792 standard.

Lastly, RO3035 is compatible with lead-free processes, making it suitable for environmentally friendly manufacturing.

RO3035 Typical Value
Property	RO3035	Direction	Units	Condition	Test Method
Electrical Properties
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0015	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-45	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	107		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	107		MΩ	COND A	IPC 2.5.17.1
Thermal Properties
Td	500		℃ TGA		ASTM D 3850
Coefficient of Thermal Expansion (-55 to 288℃)	17 17 24	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Thermal Conductivity	0.5		W/M/K	50℃	ASTM D 5470
Mechanical Properties
Copper Peel Stength	10.2		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Young's Modulus	1025 1006		MPa	23℃	ASTM D 638
Dimensional Stability (MD, CMD)	-0.11 0.11		mm/m	Condition A	IPC TM-650 2.2.4
Physical Properties
Flammability	V-0				UL 94
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Density	2.1		gm/cm3	23℃	ASTM D 792
Lead-free Process Compatible	Yes

PCB Capability (RO3035)

Our PCB manufacturing services offer a range of capabilities to accommodate your specific requirements. Let's explore the various aspects of our PCB capabilities.

Layer Count: We can produce Double Layer, Multilayer, and Hybrid PCBs. Whether you need a simple double-layer board or a more complex multilayer or hybrid design, we have the expertise to fulfill your needs.

Copper Weight: We offer options for copper weight, including 1oz (35µm) and 2oz (70µm). You can choose the appropriate copper weight based on your design requirements and desired electrical conductivity.

Laminate Thickness: Our PCBs can be manufactured with different laminate thicknesses to suit your needs. We offer options such as 10mil (0.254mm), 20mil (0.508mm), and 60mil (1.524mm) laminates. The choice of laminate thickness depends on factors like board rigidity, space constraints, and specific application requirements.

PCB Size: Our manufacturing capabilities accommodate PCB sizes up to 400mm X 500mm. This size limit ensures that we can handle a wide range of board dimensions, allowing flexibility in your design.

Solder Mask: We offer various solder mask colors to meet your aesthetic and functional preferences. You can choose from options such as Green, Black, Blue, Yellow, Red, and more. The solder mask not only enhances the appearance of the PCB but also provides insulation and protection for the copper traces.

Surface Finish: We provide multiple surface finish options to meet your specific needs. You can choose from options such as Bare Copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure Gold, OSP (Organic Solderability Preservative), and more.

PCB Material:	Ceramic-filled PTFE composites
Designation:	RO3035
Dielectric constant:	3.50±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	10mil (0.254mm), 20mil(0.508mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..

Applications

RO3035 PCBs find widespread use in various applications due to their excellent electrical and thermal properties. Here are some typical applications where RO3035 PCBs are commonly utilized:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems -power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes