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RO3010 High Frequency PCB Built on 25mil 0.635mm Substrate with Immersion Silver

Shipped:23rd-Oct-2023

We are pleased to introduce our RO3010 High Frequency PCB, built on a 25mil (0.635mm) substrate with an immersion silver finish. This advanced PCB is specifically designed to meet the stringent requirements of high-frequency applications, providing exceptional signal integrity and performance.

Laminate Introduction

We have utilized Rogers RO3010 ceramic-filled PTFE composites, known for their high performance and reliability. The PCB substrate has a dielectric constant of 10.2+/- .30 at 10 GHz/23°C, ensuring excellent electrical performance. With a dissipation factor of 0.0022 at the same frequency and temperature, signal loss is minimized. The substrate offers a high thermal stability with a Td> 500°C, making it suitable for demanding environments. It has a thermal conductivity of 0.95 W/mK, aiding in efficient heat dissipation. The moisture absorption is at a low level of 0.05%. The PCB operates within a wide temperature range of -40℃ to +85℃.

Features & Benefits:

The PCB boasts a low coefficient of thermal expansion, ranging from -55 to 288 °C, with values of 13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), and 16 ppm/°C (Z-axis) respectively. The material used exhibits dimensional stability, with the expansion coefficient matched to copper, ensuring reliable performance. We offer economical laminate pricing, suitable for volume manufacturing processes.

PCB Stackup:

The PCB features a 2-layer rigid design. Copper_layer_1 has a thickness of 35 μm. The Rogers RO3010 substrate is 25mil (0.635mm) thick. Copper_layer_2 also has a thickness of 35 μm.

PCB Construction Details:

The board dimensions are 111.92mm x 81.44 mm. The minimum trace/space is set at 4/7 mils, allowing for precise routing and integration of components. The minimum hole size is 0.5mm, accommodating various component and interconnect requirements. The PCB does not include blind vias. The finished board thickness is 0.75mm, providing a balance between thickness and space constraints. It has a finished copper weight of 1 oz (1.4 mils) on outer layers. The via plating thickness is 20 μm. The surface finish is Immersion Silver. Silkscreen and solder mask are not applied on both the top and bottom sides. Each PCB undergoes a 100% electrical test prior to shipment to ensure its quality and reliability.

PCB Statistics

The PCB consists of 35 components. It has a total of 170 pads, including 113 through-hole pads and 57 top SMT pads. There are no bottom SMT pads. The PCB includes 79 vias and 4 nets. Type of Artwork Supplied: Gerber RS-274-X. Accepted Standard: The PCB adheres to the IPC-Class-2 standard.

Availability Our PCBs are available worldwide, ensuring accessibility for engineers and manufacturers globally.

Typical Applications

Our PCB is well-suited for various applications, including automotive radar, global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), patch antennas for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.

Parameter	Value
PCB Substrates	Rogers RO3010 ceramic-filled PTFE composites
	Dielectric constant: 10.2+/- .30 at 10 GHz/23°C
	Dissipation factor: 0.0022 at 10 GHz/23°C
	Td> 500°C
	Thermal Conductivity: 0.95 W/mK
	Moisture Absorption: 0.05%
	-40℃?to +85℃?operation
Features & Benefits	Low Coefficient of Thermal Expansion:
	- X-axis: 13 ppm/°C
	- Y-axis: 11 ppm/°C
	- Z-axis: 16 ppm/°C
	Material exhibits dimensional stability with expansion coefficient
	matched to copper
	Economical laminate pricing for Volume manufacturing process
	Suitable for use with multi-layer board designs
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm
	Rogers RO3010 Substrate: 25mil (0.635mm)
	Copper_layer_2: 35 μm
Construction details	Board dimensions: 111.92mm x 81.44mm
	Minimum Trace/Space: 4/7 mils
	Minimum Hole Size: 0.5mm
	No Blind vias
	Finished board thickness: 0.75mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Silver
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 35
	Total Pads: 170
	Thru Hole Pads: 113
	Top SMT Pads: 57
	Bottom SMT Pads: 0
	Vias: 79
	Nets: 4
Artwork	Gerber RS-274-X
Accepted standard:	IPC-Class-2
Availability	Worldwide
Typical Applications	Automotive radar applications
	Global positioning satellite antennas
	Cellular telecommunications systems - power amplifiers and antennas
	Patch antenna for wireless communications
	Direct broadcast satellites
	Datalink on cable systems
	Remote meter readers
	Power backplanes

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