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RO3010 Mini High Frequency PCB Built on 5mil Substrate with 8mm x 8mm Dimension

Shipped: 13th-Oct-2023

We are excited to introduce our RO3010 Mini High Frequency PCB, built on a 5mil substrate with an 8mm x 8mm dimension. This compact and high-performance PCB is specifically designed for applications where space is limited, but high-frequency performance is critical.

Rogers RO3010

Rogers RO3010 ceramic-filled PTFE composites are an excellent choice for PCB substrates, offering exceptional properties for a wide range of applications. With a dielectric constant of 10.2+/- .30 at 10 GHz/23°C and a dissipation factor of 0.0022 at the same frequency and temperature, these substrates provide reliable and consistent electrical performance. They also offer a high thermal stability, with a Td> 500°C, ensuring their suitability for demanding environments.

The RO3010 PCB substrates exhibit a low coefficient of thermal expansion (-55 to 288 °C), with values of 13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), and 16 ppm/°C (Z-axis) respectively. This low coefficient of thermal expansion, matched to copper, ensures excellent dimensional stability and reliability. Moreover, these substrates are compatible with multi-layer board designs, making them versatile for various applications.

PCB Stackup

The stackup of this RO3010 PCB typically involves a 2-layer rigid PCB design. This includes copper layers on both sides of the RO3010 substrate, each with a thickness of 35 μm. The RO3010 substrate itself has a thickness of 5 mil (0.127 mm), providing a compact and efficient PCB layout while maintaining high performance.

PCB Construction Details

In terms of construction details, this RO3010 PCB has a compact board size of 8mm x 8mm, making them suitable for space-constrained applications. The minimum trace/space is set at 7/7 mils, allowing for precise routing and integration of components. The minimum hole size is 0.20mm, accommodating various component and interconnect requirements. The finished board thickness is 0.2mm, providing a balance between board thickness and space constraints.

RO3010 PCBs undergo a 100% electrical test prior to shipment, ensuring that each PCB meets the required specifications and guarantees reliability. The PCB statistics show that a typical RO3010 PCB consists of 1 component, 3 total pads (2 through-hole pads and 1 top SMT pad), 2 vias, and 1 net.

Artwork and Standards

These PCBs are supplied in Gerber RS-274-X format and meet the IPC-Class-2 standard, ensuring compatibility and adherence to industry standards. RO3010 PCBs are readily available to worldwide, making them easily accessible for engineers and manufacturers globally.

Typical Applications

RO3010 PCBs find application in various industries, including automotive radar applications, global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), wireless communications (patch antennas), direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.

Parameter	Value
PCB Substrates	Rogers RO3010 ceramic-filled PTFE composites
	Dielectric constant: 10.2+/- .30 at 10 GHz/23°C
	Dissipation factor: 0.0022 at 10 GHz/23°C
	Td> 500°C
	Thermal Conductivity: 0.95 W/mK
	Moisture Absorption: 0.05%
	Temperature Range: -40℃ to +85℃ operation
Features & Benefits	Low Coefficient of Thermal Expansion (-55 to 288 °C): 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z)
	Dimensional stability with expansion coefficient matched to copper
	Economical laminate pricing for Volume manufacturing process
	Suitable for use with multi-layer board designs
Stackup	2-layer rigid PCB
	Copper_layer_1 - 35 μm
	Rogers RO3010 Substrate - 5mil (0.127mm)
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 8mm x 8mm=1PCS
	Minimum Trace/Space: 7/7 mils
	Minimum Hole Size: 0.20mm
	No Blind vias
	Finished board thickness: 0.2mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Bare copper (no surface finish)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 1
	Total Pads: 3
	Thru Hole Pads: 2
	Top SMT Pads: 1
	Bottom SMT Pads: 0
	Vias: 2
	Nets: 1
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	Automotive radar applications
	Global positioning satellite antennas
	Cellular telecommunications systems - power amplifiers and antennas
	Patch antenna for wireless communications
	Direct broadcast satellites
	Datalink on cable systems
	Remote meter readers
	Power backplanes

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