We are excited to introduce our Hybrid PCB, built on a combination of RO3003 and S1000-2M substrates. This innovative PCB combines the unique properties of these two high-quality materials to offer exceptional performance and versatility.

RO3003 Features

Rogers RO3003 PCB substrates boast the following key specifications: 1.Dielectric constant of 3.0 +/- .04 at 10 GHz and 23°C, ensuring precise signal transmission. 2.Dissipation factor of 0.001 at 10 GHz and 23°C, minimizing signal loss. 3.Coefficient of Thermal Expansion (CTE) values of 17 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 25 ppm/°C (Z-axis), ensuring dimensional stability across temperature variations. 4.Operating temperature range from -40℃ to +85℃, providing reliability in demanding environments. 5.Rogers RO3003 PCB substrates offer several notable features, including: 6.Low CTE values in the X, Y, and Z axes (17, 16, and 25 ppm/°C, respectively), ensuring stability and reliable performance. 7.Low Dk loss, enabling applications up to 77 GHz. 8.Excellent mechanical properties over a wide temperature range, making them suitable for reliable stripline and multi-layer board constructions. 9.Ideal for multi-layer board designs and compatibility with epoxy glass multi-layer board hybrid designs.

PCB Stackup:

8-layer rigid PCB Copper_layer_1: 18 μm Rogers 3003 Core: 0.127 mm Copper_layer_2: 18 μm Prepreg FastRise 28: 0.11 mm Copper_layer_3: 18 μm S1000-2M FR-4: 0.66 mm Copper_layer_4: 18 μm Prepreg: 0.11 mm Copper_layer_5: 18 μm S1000-2M FR-4: 0.36 mm Copper_layer_6: 35 μm Prepreg: 0.11 mm Copper_layer_7: 18 μm S1000-2M FR-4: 0.36 mm Copper_layer_8: 35 μm

PCB Construction

Details Detailed construction specifications for the hybrid PCBs include: Board dimensions: 122.3mm x 94.4 mm = 1PCS, +/- 0.15mm Minimum Trace/Space: 4/4 mils, facilitating intricate circuitry. Minimum Hole Size: 0.35mm, allowing for precise component placement. Blind vias between layers L7-L8, enhancing design flexibility. Finished board thickness: 2.2mm, providing a robust and compact form factor. Finished Cu weight: 0.5 oz (0.7 mils) inner layers, 1oz (1.4mil) outer layers, ensuring ample conductivity. Via plating thickness: 20μm, ensuring reliable electrical connections. Surface finish: Immersion Gold, facilitating solderability. Top Silkscreen: White, aiding component identification. Bottom Silkscreen: White, for a clean and professional appearance. Top Solder Mask: Matt Black, protecting the copper traces. Bottom Solder Mask: Matt Black, ensuring a uniform look. Silkscreen is forbidden on solder pads, avoiding any interference. 100% Electrical test used prior to shipment, ensuring functionality. Top layer designed with 11mil track for 50-ohm single-end impedance and 7mil/7mil track/gap for 100-ohm differential impedance.