RO3003 RF PCB 0.127mm| Bicheng PCB

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RO3003 RF PCB Built on 0.127mm core and 6-layer Structure with Immersion gold and Impedance Control

Shipped: 8th-Sep-2023

Introducing our newly shipped RF PCB, offered to deliver exceptional performance and reliability in a wide range of applications. This advanced PCB utilizes Rogers RO3003 ceramic-filled PTFE composites, offering superior characteristics for demanding electronic designs.

The PCB material features a dielectric constant of 3.0 +/- .04 at 10 GHz and a low dissipation factor of 0.001 at the same frequency and temperature. With a wide operating temperature range of -40℃ to +85℃, it ensures reliable performance even in challenging environments.

Key Features

Low X, Y, and Z axis coefficient of thermal expansion (CTE) of 17, 16, and 25 ppm/°C, respectively, ensuring stability and reliability. Low Dk loss allows for high-frequency applications up to 77 GHz. Excellent mechanical properties across temperature variations, enabling stripline and multi-layer board constructions with reliability. Ideal for multi-layer board designs and compatible with epoxy glass multi-layer board hybrid designs.

The 6-layer rigid PCB stackup consists of copper layers, Rogers 3003 core, prepreg FastRise 28, and S1000-2M FR-4 layers, providing a robust and versatile platform for complex circuitry.

Construction Details

Board dimensions: 82.91mm x 56.61mm with a tolerance of +/- 0.15mm Minimum trace/space: 5/5 mils Minimum hole size: 0.3mm Includes blind vias (L1-L2, L1-L3) Finished board thickness: 1.22mm Finished copper weight: 0.5 oz (0.7 mils) for inner layers, 1 oz (1.4 mils) for outer layers Via plating thickness: 20μm Surface finish: Immersion Gold Top and bottom silkscreen in white color Top and bottom solder mask in green color (silkscreen is not allowed on solder pads) 100% Electrical test performed Top layer designed with 6mil track width for 50-ohm single-ended impedance and 7mil track width with 6mil gap for 100-ohm differential impedance.

PCB Statistics

Components: 70 Total Pads: 116 Thru Hole Pads: 52 Top SMT Pads: 43 Bottom SMT Pads: 21 Vias: 234 Nets: 28

The supplied artwork is in Gerber RS-274-X format, adhering to the IPC-Class-2 quality standard. Our RF PCB is available worldwide, ensuring accessibility for customers across the globe.

This versatile PCB finds applications in various fields, including band-pass filters, microstrip patch antennas, voltage-controlled oscillators, and other applications sensitive to temperature changes.

For any technical inquiries or further information, please feel free to contact us at sales@bicheng-enterprise.com. Our team is ready to provide assistance and support for your specific requirements.

Item	Value
PCB Material	Rogers RO3003 ceramic-filled PTFE composites
	Dielectric constant: 3.0 +/- 0.04 at 10 GHz 23°C
	Dissipation factor: 0.001 at 10 GHz 23°C
	CTE (X): 17 ppm/°C
	CTE (Y): 16 ppm/°C
	CTE (Z): 25 ppm/°C
	Operating Temperature: -40°C to +85°C
Features	- Low X, Y, and Z axis CTE
	- Suitable for applications up to 77 GHz
	- Ideal for multi-layer board designs
	- Compatible with epoxy glass multi-layer board hybrid designs
Stackup	6-layer rigid PCB
	Copper_layer_1: 18 μm
	Rogers 3003 Core: 0.127 mm
	Copper_layer_2: 18 μm
	Prepreg FastRise 28: 0.11 mm
	Copper_layer_3: 18 μm
	S1000-2M FR-4: 0.36 mm
	Copper_layer_4: 18 μm
	Prepreg: 0.11 mm
	Copper_layer_5: 18 μm
	S1000-2M FR-4: 0.36 mm
	Copper_layer_6: 35 μm
Construction Details	Board dimensions: 82.91mm x 56.61mm (1PCS, +/- 0.15mm)
	Minimum Trace/Space: 5/5 mils
	Minimum Hole Size: 0.3mm
	Blind vias L1-L2, L1-L3
	Finished board thickness: 1.22mm
	Finished Cu weight: 0.5 oz (0.7 mils) inner layers, 1oz (1.4mil) outer layers
	Via plating thickness: 20μm
	Surface finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: White
	Top Solder Mask: Green
	Bottom Solder Mask: Green
	Silkscreen is forbidden on solder pads
	100% Electrical test used
	Top layer, 6mil track 50-ohm single-ended impedance, 7mil/6mil track/gap 100-ohm differential impedance
PCB Statistics	Components: 70
	Total Pads: 116
	Thru Hole Pads: 52
	Top SMT Pads: 43
	Bottom SMT Pads: 21
	Vias: 234
	Nets: 28
Type of artwork supplied	Gerber RS-274-X
PCB Quality Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- Band pass filters
	- Microstrip patch antennas
	- Voltage controlled oscillators
	- Ideal for applications sensitive to temperature change

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