RO3003 High Frequency PCB

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RO3003 High Frequency PCB

Introduction

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In today's discussion, we will be focusing on the topic of RO3003 high frequency PCBs.

RO3003 high frequency laminates from Rogers are composite materials made of ceramic-filled PTFE. They are specifically designed for use in printed circuit boards that are utilized in commercial microwave and RF applications.

The key advantage of RO3003 laminates lies in their exceptional stability of dielectric constant (Dk) across various temperatures and frequencies. Unlike PTFE glass materials that often exhibit a significant change in Dk near room temperature, RO3003 laminates eliminate this abrupt shift. This characteristic makes them highly suitable for a range of applications, including automotive radar (operating at 77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure, especially in the mmWave frequency bands.

Data Sheet

As a high-frequency PCB material, RO3003 possesses following typical values and properties:

Electrical Properties:

It has a Dielectric Constant (εProcess) value of 3.0±0.04 in the Z-direction at 10 GHz and 23℃, determined using the IPC-TM-650 2.5.5.5 Clamped Stripline test method.

It has a design Dielectric Constant value of 3 in the Z-direction, covering a frequency range of 8 GHz to 40 GHz, measured using the Differential Phase Length Method.

The material has a low dissipation factor of 0.001 in the Z-direction at 10 GHz and 23℃, determined using the IPC-TM-650 2.5.5.5 test method.

The thermal coefficient of the dielectric constant is -3 ppm/℃ in the Z-direction, measured at 10 GHz across a temperature range of -50℃ to 150℃ using the IPC-TM-650 2.5.5.5 test method.

RO3003 exhibits a volume resistivity of 10^7 MΩ.cm under specified conditions (COND A), according to the IPC 2.5.17.1 test method.

It has a surface resistivity of 10^7 MΩ under specified conditions (COND A), determined using the IPC 2.5.17.1 test method.

Thermal Properties:

RO3003 has a decomposition temperature (Td) of 500℃, evaluated using the TGA (Thermogravimetric Analysis) method according to ASTM D 3850.

The coefficient of thermal expansion ranges from 17 to 25 ppm/℃ in the X, Y, and Z directions, measured from -55℃ to 288℃ at 23℃/50% RH using the IPC-TM-650 2.4.4.1 test method.

It has a thermal conductivity of 0.5 W/M/K at 50℃, determined by the ASTM D 5470 test method.

Mechanical Properties:

The RO3003 material exhibits a copper peel strength of 12.7 Ib/in. under specific conditions (1oz, EDC after solder float), tested according to the IPC-TM 2.4.8 method.

The Young's modulus of RO3003 is 930 MPa in the X-direction and 823 MPa in the Y-direction at 23℃, determined by the ASTM D 638 test method.

RO3003 demonstrates dimensional stability with values ranging from -0.06 to 0.07 mm/m in the X and Y directions, tested under specified conditions (COND A) using the IPC-TM-650 2.2.4 test method.

Physical Properties:

RO3003 possesses a V-0 flammability rating according to the UL 94 standard.

The material has a moisture absorption rate of 0.04% under specific conditions (D48/50), tested using the IPC-TM-650 2.6.2.1 method.

RO3003 has a density of 2.1 gm/cm3 at 23℃, determined by the ASTM D 792 test method.

The specific heat of the material is 0.9 j/g/k, calculated based on its properties.

Finally, RO3003 is compatible with lead-free processes.

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Electrical Properties
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	107		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	107		MΩ	COND A	IPC 2.5.17.1
Thermal Properties
Td	500		℃ TGA		ASTM D 3850
Coefficient of Thermal Expansion (-55 to 288℃)	17 16 25	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Thermal Conductivity	0.5		W/M/K	50℃	ASTM D 5470
Mechanical Properties
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Young's Modulus	930 823	X Y	MPa	23℃	ASTM D 638
Dimensional Stability	-0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Physical Properties
Flammability	V-0				UL 94
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Density	2.1		gm/cm3	23℃	ASTM D 792
Specific Heat	0.9		j/g/k		Calculated
Lead-free Process Compatible	Yes

PCB Capability(RO3003)

Our PCB manufacturing capability includes the following options:

Layer count:

We can produce single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs depending on your requirements.

Copper weight:

We offer copper weight options of 1oz (35µm) and 2oz (70µm) for the copper layers on the PCB.

Dielectric thickness:

We can provide dielectric thickness options of 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) to accommodate different design specifications.

PCB size:

Our manufacturing capability allows for PCB sizes up to 400mm X 500mm, enabling the production of larger PCBs.

Solder mask:

We offer a range of solder mask colors including green, black, blue, yellow, red, and more, allowing you to select the desired color for your PCB.

Surface finish:

You have the flexibility to choose from various surface finishes for your PCB, including immersion gold, HASL (Hot Air Solder Leveling), immersion silver, immersion tin, ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold), OSP (Organic Solderability Preservative), bare copper, pure gold, and more. This allows you to select the surface finish that best suits your application and requirements.

PCB Capability (RO3003)
PCB Material:	Ceramic-filled PTFE Composites
Designation:	RO3003
Dielectric constant:	3.00± 0.04 at 10GHz
Dissipation factor	0.0010 at 10GHz
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness:	5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

A PCB and Applications

Displayed on the screen is a double-sided RO3003 PCB with immersion silver, specially tailored for patch antennas.

RO3003 PCB demonstrates versatility in several applications, encompassing:
* Automotive radar systems
* Global positioning satellite (GPS) antennas
* Cellular telecommunications systems involving power amplifiers and antennas
* Wireless communications through patch antennas
* Direct broadcast satellite (DBS) systems
* Datalink on cable systems
* Remote meter reading devices
* Power backplanes

Should you require further details or have any other questions, feel free to let me know.