2. Features
- Dielectric Constant of DK 3.0 +/-0.04 at 10GHz and 3.07 at 77 GHz
- Low Dissipation Factor of 0.0011 at 10GHz
- Excellent Thermal Coefficient of dielectric constant of -35 ppm/°C
- Very Low Profile (VLP) ED copper
- Copper matched CTE with X axis of 16ppm/°C, Y axis of 17ppm/°C, Z axis of 18ppm/°C
- Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity
- Enhanced Filler System

3. Benefits:
- Best in class performance for insertion loss
- Minimize dielectric constant variation in finished PCB
- Enable trend toward more small diameter vias

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO3003G2 Core - 0.127 mm (5mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 41.71mm x 64mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.2mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: NO
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 9
Total Pads: 27
Thru Hole Pads: 15
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 21
Nets: 2

10. Some Typical Applications:
- Adaptive cruise control
- Forward collision warning
- Active brake assist
- Lane change assist
- Traffic jam pilot
- Parking pilot
- Blind spot detection