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RF-60TC PCB 2-layer 5mil High Frequency PCB

Shipped: 21st-FEB-2024

1. Introduction of RF-60TC

RF-60TC high frequency material is highly thermally conductive, ceramic-filled, glass-reinforced PTFE laminate for high power RF and microwave applications. This material is designed to provide lower operating temperatures in high power applications and better gains and efficiencies in miniaturized antenna applications for the 6.15 DK market through improved dielectric heat dissipation and exceptionally low dielectric losses.

RF-60TC's enhanced heat transfer allows for additional design margin, extends the active components' lifetime and improves long term reliability. RF-60TC has excellent adhesion to very low profile and reverse treated copper for reduced insertion loss. The low CTE and improved dimensional stability of RF-60TC make it possible to build high layer count multilayer PCBs with improved plated through hole reliability.

2. Features - Glass Reinforced PTFE Ceramic Composites - Dielectric Constant (Dk) of 6.15 at 10 GHz - Dissipation factor of 0.002 at 10 GHz/23°C - Thermal coefficient of Dk of -3.58 ppm/°C during -50°C to 150°C - Low moisture absorption of 0.03% - High thermal conductivity of 0.9 W/M*K (unclad), 1.0W/M*K(0.5oz), 1.05 W/M*K(1oz) - CTE X-axis, Y-axis of 9.9 ppm/°C and 40 ppm/°C of Z-axix

3. Benefits - Improved loss tangent - High thermal conductivity - Enhanced dimensional stability - Low Z-axis CTE of 40 ppm/°C - Excellent adhesion to metal - Stable DK over frequency - Stable DK over temperature - Low moisture absorption

4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm RF-60TC- 0.127 mm (5mil) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 54.19mm x 34.47mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 5/6 mils - Minimum Hole Size: 0.30mm - No Blind vias. - Finished board thickness: 0.25mm - Finished Cu weight: 1 oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Gold - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: No - Bottom Solder Mask: No - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 14 Total Pads: 32 Thru Hole Pads: 21 Top SMT Pads: 11 Bottom SMT Pads: 0 Vias: 21 Nets: 3

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications: - High Power Amplifiers - Miniaturized Antennas - GPS, Patch, RFID reader - Filters, Couplers & Dividers - Satellites

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