RF-60A PCB 31mil| Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RF-60A RF PCB Built on 31mil 0.787mm Substrates with Double Sided Copper and Immersion Gold

Shipped: 8th-Sep-2023

The RF-60A PCB is constructed using an organic ceramic fiberglass reinforced laminate, ensuring superior strength and durability. With a dielectric constant of 6.15 at 10 GHz and a dissipation factor of 0.0028 at the same frequency, this PCB guarantees stable performance and minimal signal loss. Its low moisture absorption rate of 0.02% ensures reliable operation even in humid environments. Additionally, the RF-60A PCB exhibits excellent dimensional stability and low Z-axis expansion, making it suitable for demanding applications.

The benefits of the RF-60A PCB are numerous. Its low moisture absorption property ensures long-term reliability, while the stable dielectric constant over frequency allows for consistent signal integrity. The board's dimensional stability ensures accurate and precise circuit performance. With high flexural strength and exceptional interlaminar bonds, this PCB can withstand rigorous operating conditions. Moreover, the RF-60A PCB is ROHS and WEEE compliant, promoting environmentally friendly practices.

This RF-60A PCB features a 2-layer rigid stackup configuration. It consists of copper layer 1 with a thickness of 35 μm, an RF-60A core with a thickness of 31mil (0.787 mm), and copper layer 2 with a thickness of 35 μm. These specifications guarantee optimal performance and reliability for your electronic designs.

When it comes to construction details, this RF-60A PCB leaves no room for compromise. The board dimensions of 157mm x 109mm (± 0.15mm) provide ample space for your designs. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.35mm, enabling intricate and compact circuit layouts. With no blind vias, the RF-60A PCB facilitates seamless connectivity. The finished board thickness is 0.9mm, and the finished Cu weight is 1oz (1.4 mils) on outer layers. The via plating thickness is 25 μm, ensuring robust electrical connections. The surface finish is immersion gold, providing excellent conductivity and corrosion resistance. The top silkscreen is in white, while the top solder mask is green. Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

The RF-60A PCB boasts impressive statistics, making it a versatile and reliable choice for your projects. It supports up to 25 components and offers a total of 172 pads, including 125 thru-hole pads and 47 top SMT pads. With 153 vias and 6 nets, this PCB provides excellent connectivity and signal routing capabilities.

It adheres to the IPC-Class-2 quality standard, guaranteeing top-notch performance and reliability. With worldwide availability, this PCB solution is accessible to customers across the globe.

The RF-60A PCB finds its applications in various domains, including power amplifiers, filters, couplers, passive components, and antennas. Its versatility and exceptional performance make it an ideal choice for demanding electronic designs.

For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Embrace the future of electronic design with the RF-60A PCB and unlock the true potential of your projects.

Item	Value
RF-60A PCB Material	Organic ceramic fiberglass reinforced laminate
	Dielectric Constant at 10 GHz: 6.15
	Dissipation Factor at 10 GHz: 0.0028
	Moisture Absorption: 0.02%
	x CTE (Coefficient of Thermal Expansion): 9 ppm/°C
	y CTE (Coefficient of Thermal Expansion): 8 ppm/°C
	z CTE (Coefficient of Thermal Expansion): 69 ppm/°C
Benefits	- Low moisture absorption
	- Stable Dk over frequency
	- Dimensionally stable
	- Low Z-axis expansion
	- High flexural strength
	- Exceptional interlaminar bonds
	- ROHS & WEEE compliant
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm
	RF-60A Core: 31 mil (0.787 mm)
	Copper Layer 2: 35 μm
Construction Details	Board dimensions: 157 mm x 109 mm (8 PCS, 8 Types), +/- 0.15 mm
	Minimum Trace/Space: 5/6 mils
	Minimum Hole Size: 0.35 mm
	No blind vias
	Finished board thickness: 0.9 mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 25 μm
	Surface finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 25
	Total Pads: 172
	Thru Hole Pads: 125
	Top SMT Pads: 47
	Bottom SMT Pads: 0
	Vias: 153
	Nets: 6
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Applications	- Power Amplifiers
	- Filters & Couplers
	- Passive Components
	- Antennas

BACK TO SEPTEMBER