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Taconic RF-35 RF PCB Built on 60mil 1.524mm Substrates with 2oz Copper and Immersion Tin

Shipped: 21st-Sep-2023

Introducing our RF-35 PCB board, part of the renowned Taconic ORCER family. Engineered with precision and reliability in mind, this material is specifically designed for high-frequency applications, ensuring optimal performance for your RF designs.

The RF-35 PCB Material features a combination of PTFE Ceramic and woven glass reinforcement, guaranteeing exceptional signal integrity and durability. With a Dielectric Constant of 3.5 at 1.9 GHz, this material offers reliable and accurate signal transmission, minimizing loss and ensuring consistent performance. Experience unparalleled signal integrity with an impressively low Dissipation Factor of 0.0018 at 1.9 GHz, enabling your RF designs to operate at peak efficiency.

Safety and reliability are paramount, which is why RF-35 PCB boasts a Dielectric Breakdown of 41 kV, providing robust insulation and protection even in demanding environments. Additionally, the material exhibits excellent dimensional stability with an x-axis CTE of 19 ppm/°C, y-axis CTE of 24 ppm/°C, and z-axis CTE of 64 ppm/°C, ensuring reliable performance and compatibility with various assembly processes.

Designed as a 2-layer rigid PCB, this RF-35 PCB board offers a stackup consisting of copper_layer_1 (70μm or 2oz), an RF-35 Core with a thickness of 60mil (1.524mm), and copper_layer_2 (70μm or 2oz). This construction ensures optimal signal integrity, minimizing losses and maximizing the performance of your RF circuits.

Let's explore the construction details of this RF-35 PCB. With a spacious board dimension of 88mm x 88mm (± 0.15mm), you have ample space to bring your designs to life. Achieve precise and intricate layouts with a minimum Trace/Space of 5/6 mils. The minimum Hole Size of 0.4mm offers versatility for component mounting. The absence of Blind vias simplifies the design and manufacturing processes. With a finished board thickness of 1.6mm, our RF-35 PCB strikes the perfect balance between durability and space efficiency. The outer layers feature a finished Cu weight of 2oz (2.8 mils), ensuring excellent conductivity. Reliable electrical connections are guaranteed with a via plating thickness of 25 μm. The surface finish of Immersion Tin provides corrosion resistance and ensures a reliable solderable surface. The top layer features a White Silkscreen, adding a professional touch to your designs. The absence of Bottom Silkscreen and Solder Masks contributes to a clean and sleek appearance. Each RF-35 PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

Rest assured, our RF-35 PCB adheres to the widely accepted Gerber RS-274-X artwork standard. It also meets the stringent IPC-Class-2 quality standard, ensuring reliable performance and compliance with industry requirements. With worldwide availability, you can access the advanced features and benefits of the RF-35 PCB board no matter where you are located.

The RF-35 PCB finds extensive applications in various industries, including Power Amplifiers, Filters and Couplers, and Passive Components. Its versatility and exceptional performance make it the ideal choice for demanding RF applications.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific RF design requirements.

Item	Value
PCB Material	One Of Taconic ORCER Family, PTFE Ceramic - Woven Glass Reinforcement
	Dielectric Constant at 1.9 GHz: 3.5
	Dissipation Factor at 1.9 GHz: 0.0018
	Dielectric Breakdown: 41 kV
	X-CTE: 19 ppm/°C
	Y-CTE: 24 ppm/°C
	Z-CTE: 64 ppm/°C
Stackup	2-layer rigid PCB
	Copper_layer_1: 70 μm (2oz)
	RF-35 Core: 60 mil (1.524 mm)
	Copper_layer_2: 70 μm (2oz)
Construction Details	Board Dimensions: 88 mm x 88 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 5/6 mils
	Minimum Hole Size: 0.4 mm
	No Blind Vias
	Finished Board Thickness: 1.6 mm
	Finished Cu Weight: 2 oz (2.8 mils) outer layers
	Via Plating Thickness: 25 μm
	Surface Finish: Immersion Tin
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 16
	Total Pads: 108
	Thru Hole Pads: 83
	Top SMT Pads: 25
	Bottom SMT Pads: 0
	Vias: 103
	Nets: 7
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Benefits	- Low Cost
	- Excellent Peel Strength
	- Exceptionally Low Dissipation Factor
	- Low Moisture Absorption
	- Enhanced Surface Smoothness
Applications	- Power Amplifiers
	- Filters and Couplers
	- Passive Components

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