Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RF-35 PCB Built on 20mil 0.508mm Core with 1oz Copper and Immersion Tin

Shipped: 4th-Sep-2023  

Introducing our high-quality PCB leveraging Taconic ORCER family, a PTFE Ceramic woven glass reinforcement material. This 2-layer rigid PCB is offered to deliver exceptional performance and reliability for a wide range of applications.

The PCB material boasts impressive characteristics, with a Dielectric Constant of 3.5 at 1.9GHz, ensuring reliable signal transmission. It exhibits an exceptionally low Dissipation Factor of 0.0018 at 1.9GHz, resulting in minimal signal loss. With a Dielectric Breakdown of 41 kV, this PCB offers enhanced electrical insulation capabilities.

The PCB also features excellent dimensional stability with a coefficient of thermal expansion (CTE) of 19 ppm/°C (x-y) and 24 ppm/°C (z). This ensures that the PCB maintains its integrity across varying temperatures, providing long-term reliability.
The stackup consists of a 20mil (0.508 mm) RF-35 Core sandwiched between two copper layers (35 μm each). This configuration enables efficient signal transmission and reliable performance.
With a compact board size of 115mm x 59 mm, this PCB offers ample space for 25 components, 168 total pads, and 211 vias. The minimum trace/space of 6/4 mils allows for intricate circuit designs, while the minimum hole size of 0.3mm supports precise component mounting.
Manufactured to high standards, our PCB undergoes a 100% electrical test before shipment to ensure its quality and reliability. It adheres to the IPC-Class-2 quality standard, ensuring consistent performance.
This versatile PCB finds applications in power amplifiers, filters and couplers, and passive components. Its low cost combined with excellent peel strength, low dissipation factor, low moisture absorption, and enhanced surface smoothness make it an ideal choice for various industries.
For any technical inquiries or further information, please reach out at sales@bicheng-enterprise.com. We are committed to providing excellent customer support and delivering our high-quality PCBs worldwide.
 

Item

Value

PCB Material

Taconic ORCER family, PTFE Ceramic - woven glass reinforcement

Dielectric Constant at 1.9GHz: 3.5

Dissipation Factor at 1.9GHz: 0.0018

Dielectric Breakdown: 41 kV

CTE (X-Y): 19 ppm/°C, CTE (Z): 64 ppm/°C

Benefits

- Low Cost

- Excellent Peel Strength

- Exceptionally Low Dissipation Factor

- Low Moisture Absorption

- Enhanced Surface Smoothness

Stackup

2-layer rigid PCB

Copper_layer_1: 35 μm

RF-35 Core: 20mil (0.508 mm)

Copper_layer_2: 35 μm

Construction Details

Board dimensions: 115mm x 59mm (1PCS, +/- 0.15mm)

Minimum Trace/Space: 6/4 mils

Minimum Hole Size: 0.3mm

No Blind vias

Finished board thickness: 0.6mm

Finished Cu weight: 1oz (1.4 mils) outer layers

Via plating thickness: 25μm

Surface finish: Immersion Tin

Top Silkscreen: White

Bottom Silkscreen: No

Top Solder Mask: No

Bottom Solder Mask: No

100% Electrical test used prior to shipment

PCB Statistics

Components: 25

Total Pads: 168

Thru Hole Pads: 112

Top SMT Pads: 56

Bottom SMT Pads: 0

Vias: 211

Nets: 9

Type of artwork supplied

Gerber RS-274-X

PCB Quality Standard

IPC-Class-2

Availability

Worldwide

Some Typical Applications

- Power amplifiers

- Filters and couplers

- Passive components

 
  PCBBACK TO SEPTEMBER
 

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