Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

RF-35A2 PCB 2-layer 5mil High Frequency PCB

Shipped: 20th-FEB-2024  

1. Introduction of RF-35A2
RF-35A2 is designed with an ultra low fiberglass content to achieve “best in class” insertion loss properties and a homogeneous dielectric constant throughout the laminate. The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x-y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers.

RF-35A2 is manufactured in a proprietary multi-step process that provides excellent dielectric properties along with
superior copper peel adhesion. The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

2. Features - Ultra Low Loss Power Amplifier Substrate - Dielectric Constant (Dk) of 3.5 at 10 GHz - Dissipation factor of 0.0015 at 10 GHz/23°C - X-CTE of 10 ppm/°C, Y-CTE of 13ppm/°C, Z-CTE of 108ppm/°C. - Peel Strength (1 oz. VLP) of 12 lbs/in - Td of 528°C - Moisture Absorption of 0.03%
3. Benefits - Low Loss Properties - Dk Tolerance of ± 0.05 - Homogeneous Dk - Excellent Peel Strength - Low Moisture Absorption - Ease of Drilling
4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm RF-35A2- 0.127 mm (5mil) Copper_layer_2 - 35 μm
5. PCB Construction details: - Board dimensions: 76.04mm x 33.18mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 5/5 mils - Minimum Hole Size: 0.45mm - No Blind vias. - Finished board thickness: 0.25mm - Finished Cu weight: 1 oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Silver - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: No - Bottom Solder Mask: No - 100% Electrical test used prior to shipment
6. PCB Statistics: Components: 23 Total Pads: 56 Thru Hole Pads: 45 Top SMT Pads: 11 Bottom SMT Pads: 0 Vias: 24 Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Availability: worldwide
 
10. Some Typical Applications: - Power Amplifiers - Filters/Couplers - High Speed Digital - Passive Components - Wireless Antennas
 
 
 
 
  PCBBACK TO FEBRUARY
 

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3003G2, RO3010, RO3006, RO3035, RO3203, RO3206, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4725JXR, RO4730G3, RO4533, RO4534, RO4535, RO4830, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, CLTE-XT, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, TSM-DS3, PTFE PCB, Wangling RF PCB, F4BM220, F4BME220, F4BTM220, F4BTME220, F4BTMS220