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RF-30 High Frequency PCB Built on 30mil 0.762mm Substrates with HASL

Shipped: 11th-Oct-2023

We are pleased to introduce our RF-30 High Frequency PCB, built on 30mil (0.762mm) substrates with HASL (Hot Air Solder Leveling) finish. This advanced RF-30 PCBs have gained recognition for their exceptional performance and versatility in various applications. With improved features and stable mechanical properties, these substrates offer reliable solutions for high-frequency and RF applications.

Substrates Introduction Taconic RF-30 PTFE Ceramic-Glass substrates provide excellent electrical properties and mechanical stability. Key specifications include: 1.DK of 3.0 +/- 0.1 at 1.9 GHz/23°C for precise signal transmission. 2.Dissipation factor of 0.0014 at 1.9 GHz/23°C, ensuring minimal signal loss. 3.Peel strength of 10 lbs/in, ensuring secure bonding between layers. 4.Moisture absorption of 0.02%, minimizing the impact of humidity. CTE (Coefficient of Thermal Expansion) values of 11 ppm/°C (X-axis), 21 ppm/°C (Y-axis), and 208 ppm/°C (Z-axis), ensuring dimensional stability in various temperature conditions.

Substrates Features Taconic RF-30 PCB substrates offer several notable features, including: 1.Improved PIMD (Passive Intermodulation Distortion), enhancing signal integrity. 2.Improved PTH (Plated Through Hole) quality, ensuring robust interconnects. 3.Stable mechanical properties, providing consistent performance over time. 4.Stability at high frequencies, making them suitable for RF applications. 5.High-temperature stability, enabling operation in demanding environments. 6.Low moisture absorption, minimizing the impact of humidity. 7.Excellent peel strength, ensuring reliable bonding between layers. Excellent price/performance ratio, offering cost-effective solutions.

PCB Stackup: The stackup for Taconic RF-30 PCBs is designed as a 2-layer rigid board with the following configuration: Copper Layer 1: 35 μm RF-30: 0.762 mm (30mil) Copper Layer 2: 35 μm

PCB Construction Details Detailed construction specifications for Taconic RF-30 PCBs include: Board dimensions: 228.99mm x 117.25 mm = 1 PCS, +/- 0.15mm Minimum Trace/Space: 5/6 mils, facilitating intricate circuitry. Minimum Hole Size: 0.3mm, allowing for precise component placement. No blind vias, simplifying the manufacturing process. Finished board thickness: 0.8mm, ensuring a compact form factor. Finished Cu weight: 1oz (1.4 mils) outer layers, providing ample conductivity. Via plating thickness: 20 μm, ensuring reliable electrical connections. Surface finish: Hot Air Soldering Level (HASL), facilitating solderability. Top Silkscreen: White, aiding component identification. Bottom Silkscreen: No, for a clean and unobstructed underside. Top Solder Mask: Green, protecting the copper traces. Bottom Solder Mask: No, keeping the underside clear. 100% Electrical test used prior to shipment, ensuring functionality.

PCB Statistics Taconic RF-30 PCBs offer the following statistics for components, pads, vias, and nets: Components: 72 Total Pads: 181 Thru Hole Pads: 125 Top SMT Pads: 56 Bottom SMT Pads: 0 Vias: 75 Nets: 6

Artwork and Standards Taconic RF-30 PCBs conform to the Gerber RS-274-X format and meet the IPC-Class-2 standard, ensuring compatibility and high-quality manufacturing.

Availability These high-performance PCB substrates are readily available for worldwide, enabling their integration into various projects and applications.

Typical Applications Taconic RF-30 PCBs find application in a range of industries, including: Antenna and subcomponent manufacturing, ensuring reliable signal transmission. RF passive components, supporting efficient RF circuitry. Power amplifier design, facilitating robust power delivery.

Parameter	Value
1. PCB Substrates
CCL	Taconic RF-30 PTFE Ceramic-Glass
DK at 1.9 GHz/23°C	3.0 +/- 0.1
Dissipation factor at 1.9 GHz/23°C	0.0014
Peel strength	10 lbs/in
Moisture Absorption	0.02%
CTE (X-axis)	11 ppm/°C
CTE (Y-axis)	21 ppm/°C
CTE (Z-axis)	208 ppm/°C
2. Features	Improved PIMD
	Improved PTH quality
	Stable mechanical properties
	Stable at high frequencies
	High temperature stability
	Low moisture absorption
	Excellent peel strength
	Excellent price/performance ratio
	Excellent price/performance ratio
3. Stackup
2-layer rigid PCB
Copper Layer 1	35 μm
RF-30	0.762 mm (30mil)
Copper Layer 2	35 μm
4. Construction Details
Board dimensions	228.99mm x 117.25 mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.3mm
Blind vias	No
Finished board thickness	0.8mm
Finished Cu weight	1oz (1.4 mils) outer layers
Via plating thickness	20 μm
Surface finish	Hot Air Soldering Level (HASL)
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
100% Electrical test	Yes
5. PCB Statistics
Components	72
Total Pads	181
Thru Hole Pads	125
Top SMT Pads	56
Bottom SMT Pads	0
Vias	75
Nets	6
6. Artwork and Standards
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
7. Availability	Worldwide
8. Some Typical Applications	Antenna and subcomponent
	RF passive components
	Power Amplifier

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