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RF-30A High Frequency PCB 2-layer 20mil

Shipped: 15th-MAR-2024

1. Introduction of RF-30A

RF-30A is an organic-ceramic laminate in Taconic family of RF substrates. It is based on woven glass reinforcement. RF-30A is a result of
Taconic's expertise in both ceramic filler and PTFE coating technology.

RF-30A exhibits more stable electrical and mechanical properties than designers need. This low loss dielectric substrate with low profile copper foil leads to stable electrical properties with better PIMD levels and lower insertion loss over broadband frequency range. More stable mechanical properties with lower CTE values, better dimensional stability, and harder rigidity can make RF components less affected by other factors.

RF-30A's excellent peel strength for 1?2 ounce and 1 ounce RT copper is a critical aspect when rework or repeated reflow process is required. An ultra low moisture absorption rate with stable loss tangent helps minimize phase shift along the different temperature or humidity environments. Less dimensional movement also contributes to stable phase or impedance properties over broadband frequency range.

RF-30A has been optimized with ceramic to have a low Z axis CTE for improved PTH reliability and ease of fabrication of multilayer circuits. These properties also contribute to more stable PIMD performance.

2. Features

- DK of 2.97 +/- 0.05 at 1.9 GHz/23°C
- Dissipation factor of 0.0013 at 1.9 GHz/23°C, 0.0020 at 10 GHz
- CTE in X-axis of 8 ppm/°C, Y-axis of 11 ppm/°C and Z-axix of 60 ppm/°C
- Flammability Rating of UL-94V0 grade
- Density at 2.16 g/cm3

3. Benefits

- Excellent PIM Values in PCBs (measured at lower than -160 dBc*)
- Improved PTH Quality
- Stable Mechanical Properties
- Stable at High Frequencies
- Stable at High Temperatures
- Low Moisture Absorption
- Excellent Peel Strength
- Excellent Price/Performance Ratio

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm
RF-30A - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:

- Board dimensions: 138.8mm x 127.15 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical test used prior to shipment

6. PCB Statistics:

Components: 63
Total Pads: 212
Thru Hole Pads: 116
Top SMT Pads: 75
Bottom SMT Pads: 21
Vias: 94
Nets: 5

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:

- Antenna and subcomponent
- RF passive components
- Power Amplifier

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