RF-10 Taconic | 10mil 0.254mm PCB

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Taconic RF-10 High Dielectric Constant RF PCB Built on 10mil 0.254mm Substrates with Double Layer Copper and Immersion Gold

Shipped: 27th-Sep-2023

The RF-10 PCB combines the advantages of ceramic-filled PTFE and woven fiberglass to deliver outstanding electrical properties. With a Dielectric Constant of 10.2 at 10GHz and a Dissipation Factor of 0.0025 at 10GHz, this board ensures low signal loss and high signal integrity, making it perfect for RF circuits.

One of the key benefits of RF-10 PCB board is its thermal stability. It exhibits a Thermal Coefficient of DK (TCDK) of -370 ppm/°C, ensuring consistent electrical performance over a wide temperature range. The material also demonstrates low X, Y, and Z expansion coefficients, providing excellent dimensional stability and reliability.

RF-10 PCB is ideal for applications that require high DK for RF circuit size reduction. With a high DK, it allows for compact circuit designs without compromising performance. Additionally, the material offers a tight DK tolerance of 10.2 +/- 0.3, ensuring precise control over the dielectric constant.

The low loss tangent of 0.0025 (@ 10 GHz) enables superior signal transmission, minimizing signal degradation and maximizing efficiency. The material's high thermal conductivity enhances thermal management, ensuring optimal performance even in demanding conditions. It also exhibits excellent adhesion to smooth coppers, ensuring reliable connections.

Now, let's delve into the construction details of this 2-layer rigid PCB utilizing the RF-10 material. With a board dimension of 48mm x 35mm (± 0.15mm), this compact PCB provides space-efficient solutions for your high-frequency designs. The minimum Trace/Space of 6/8 mils allows for precise routing and ensures signal integrity. The minimum Hole Size of 0.3mm provides versatility in component mounting. There are no blind vias, simplifying the manufacturing process.

The finished board thickness is 0.3mm, offering a slim and lightweight solution for your applications. The outer layers have a finished Cu weight of 1oz (1.4 mils), ensuring excellent conductivity. The via plating thickness is 20 μm, providing reliable interconnections. The surface finish of Immersion Gold ensures a solderable surface and enhances the longevity of the PCB.

To maintain a streamlined design, this RF-10 PCB does not require top or bottom Silkscreen or Solder Mask. However, rest assured that each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

The PCB Statistics of this particular design include 42 components, with a total of 51 pads. Among the pads, there are 15 thru-hole pads and 36 top SMT pads. The PCB features 22 vias and 3 nets, providing the necessary connectivity for your circuitry.

Our RF-10 PCB adheres to the widely accepted Gerber RS-274-X artwork standard and meets the stringent IPC-Class-2 quality standard. This ensures reliable performance and compliance with industry requirements. Our RF-10 PCB is available worldwide, allowing customers from all regions to access its advanced features and benefits.

The versatility of RF-10 PCB makes it suitable for a variety of applications. Some typical examples include microstrip patch antennas, GPS antennas, passive components such as filters, couplers, and power dividers, aircraft collision avoidance systems, and satellite components. With its exceptional performance, reliability, and price/performance ratio, RF-10 PCB is the optimal choice for these applications.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific PCB design requirements.

Item	Value
RF-10 PCB Material	- Ceramic filled PTFE and Woven Fiberglass
	- Dielectric Constant at 10 GHz: 10.2
	- Dissipation Factor at 10 GHz: 0.0025
	- Thermal Coefficient of DK (TCDK): -370 ppm/°C
	- x CTE: 16 ppm/°C
	- y CTE: 20 ppm/°C
	- z CTE: 25 ppm/°C
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm (1oz)
	RF-10 Core: 10 mil (0.254 mm)
	Copper_layer_2: 35 μm (1oz)
Construction Details	Board Dimensions: 48 mm x 35 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 6/8 mils
	Minimum Hole Size: 0.3 mm
	No Blind Vias
	Finished Board Thickness: 0.3 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 20 μm
	Surface Finish: Immersion Gold
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 42
	Total Pads: 51
	Thru Hole Pads: 15
	Top SMT Pads: 36
	Bottom SMT Pads: 0
	Vias: 22
	Nets: 3
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Benefits	- High DK for RF circuit size reduction
	- Excellent dimensional stability
	- Tight DK tolerance (10.2 +/- 0.3)
	- Low 0.0025 loss tangent (@ 10 GHz)
	- High thermal conductivity for enhanced thermal management
	- Excellent adhesion to smooth coppers
	- Low X, Y, Z expansion
	- Excellent price/performance ratio
Applications	- Microstrip Patch Antennas
	- GPS Antennas
	- Passive Components (filters, couplers, power dividers)
	- Aircraft Collision Avoidance Systems
	- Satellite components

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