R03010 RF PCB 50mil| Bicheng PCB

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RO3010 RF PCB Built on 50mil 1.27mm Substrates with HASL and 4-Layer Structure

Shipped: 2nd-Sep-2023

Introducing our exceptional PCB (Printed Circuit Board) crafted with Rogers RO3010 ceramic-filled PTFE composites. This 2-layer rigid PCB is tailored to meet the diverse demands of applications such as automotive radar, satellite antennas, and power amplifiers. With its reliable construction and outstanding performance, it stands as an ideal choice for critical electronic circuits.

The PCB material boasts a dielectric constant of 10.2+/- .30 at 10 GHz/23°C, facilitating efficient signal transmission. Additionally, it exhibits a low dissipation factor of 0.0022 at 10 GHz/23°C, ensuring optimal signal integrity. Its impressive thermal decomposition temperature (Td) exceeding 500°C makes it well-suited for applications demanding elevated temperature resistance. The operational temperature range of -40℃ to +85℃ guarantees reliable performance across various environments.

The PCB's stackup features a 35 μm finished copper layer on each side, enveloping the Rogers RO3010 substrate with a thickness of 50 mil (1.27mm). The incorporation of prepreg and additional layers of Rogers RO3010 substrate enhances the board's structural integrity and electrical performance. The finished board measures 2.7mm in thickness, with the outer layers sporting a finished copper weight of 1 oz (1.4 mils).

Precision and performance take center stage with our PCB, offering low X, Y, and Z-axis coefficients of thermal expansion (CTE) at 13, 11, and 16 ppm/°C, respectively. This ensures dimensional stability and mitigates the risk of delamination or stress-induced failures, particularly in multi-layer board designs. Our manufacturing processes adhere to the exacting standards of ISO 9001, guaranteeing consistent quality and reliability.

To ensure the utmost quality and reliability of our PCBs, we subject each unit to a comprehensive 100% electrical test before shipment. The absence of top and bottom silkscreen and solder mask lends a clean and refined appearance, while the surface finish of Hot Air Soldering Level (HASL) provides excellent solderability and safeguards against oxidation.

Our PCB adheres to IPC-Class-2 standards, attesting to its superior quality and craftsmanship. With worldwide availability and support, this PCB caters to a global customer base.

For any technical inquiries or further information, please reach out to us at sales@bicheng-enterprise.com. Our team is dedicated to assisting you.

Item	Value
PCB Material	Rogers RO3010 ceramic-filled PTFE composites
	Dielectric Constant at 10 GHz/23°C: 10.2+/- 0.30
	Dissipation Factor at 10 GHz/23°C: 0.0022
	Td (Decomposition Temperature): >500°C
	Operation Temperature: -40℃?to +85℃
Features and Benefits	- Low X, Y, and Z axis CTE (Coefficient of Thermal Expansion): 13, 11, and 16 ppm/°C, respectively
	- Dimensional stability with expansion coefficient matched to copper
	- ISO 9001 Certified
	- Suitable for use with multi-layer board designs
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm
	Rogers RO3010 Substrate: 50 mil (1.27 mm)
	Prepreg: 0.1 mm
	Rogers RO3010 Substrate: 50 mil (1.27 mm)
	Copper Layer 2: 35 μm
Construction Details	Board dimensions: 32 mm x 32 mm (1 PCS)
	Minimum Trace/Space: 5/5 mils
	Minimum Hole Size: 0.45 mm
	No blind vias
	Finished board thickness: 2.7 mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Hot Air Soldering Level (HASL)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 18
	Total Pads: 72
	Thru Hole Pads: 43
	Top SMT Pads: 29
	Bottom SMT Pads: 0
	Vias: 2
	Nets: 2
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- Automotive radar applications
	- Global positioning satellite antennas
	- Cellular telecommunications systems (power amplifiers and antennas)
	- Patch antenna for wireless communications
	- Direct broadcast satellites
	- Datalink on cable systems
	- Remote meter readers
	- Power backplanes

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