1. Introduction of Megtron6 (M6): High Speed, Low Loss Multi-layer Materials

Tag 1: Cutting-edge Circuit Board Materials with Exceptionally Low Loss and High Heat Resistance

Tag 2: Glass Cloth-LaminateR-5775(N)/PrepregR-5670(N) with Low Dielectric Constant (Dk)

Tag 3: Standard E Glass Cloth-LaminateR-5775/PrepregR-5670

The MEGTRON 6 Family, comprising MEGTRON 6(G), MEGTRON 6(K), and MEGTRON 6(N), sets the original standards in the PCB industry. These products are well-suited for mobile, networking, and wireless applications that demand high-speed performance and extremely low loss circuit materials.

MEGTRON 6 offers exceptional high-density interconnect (HDI) capabilities and excellent thermal performance.

Customized for high-speed network equipment, mainframes, IC testers, and high-frequency measuring instruments, MEGTRON 6 represents an advanced material featuring a low dielectric constant, minimal dielectric dissipation, low transmission loss, and superior heat resistance with a Td of 410°C (770°F). MEGTRON 6 complies with IPC specification 4101/102/91.

2. Features
Low Dk = 3.61, Low Df = 0.004 (@ 10GHz)
Excellent through-hole reliability (5x better than conventional high Tg FR4 material)
Lead-free, ROHS-compliant soldering
High heat resistance

3. PCB Stackup: 12-layer rigid PCB, 5 Cores + 6 layers of Prepreg
Copper_layer_1 - 35 μm
Prepreg R-5670(G) 3313(57%) X 1

Copper_layer_2 - 35 μm
Core R5775G(HVLP) 0.1mm
Copper_Layer_3 -17μm
Prepreg R-5670(G) 1035(70%)X2

Copper_layer_4 - 17 μm
Core R5775G(HVLP) 0.1mm
Copper_Layer_5 -35μm
Prepreg R-5670(G) 3313(57%) X 3

Copper_layer_6 - 35 μm
Core R5775G(HVLP) 0.4mm
Copper_Layer_7 -35μm
Prepreg R-5670(G) 3313(57%) X 3

Copper_layer_8 - 35 μm
Core R5775G(HVLP) 0.2mm
Copper_Layer_9 -17μm
Prepreg R-5670(G) 1035(70%)X2

Copper_layer_10 - 17 μm
Core R5775G(HVLP) 0.1mm
Copper_Layer_11 -35μm

Prepreg R-5670(G) 3313(57%) X 1
Copper_Layer_12 - 35μm