1. Introduction of RF-35TC
RF-35TC offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors or capacitors. RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

2. Features
- Thermally conductive low loss laminate
- DK of 3.5 +/- 0.05 at 10 GHz/23°C
- Dissipation factor of 0.002 at 10 GHz/23°C
- Thermal Conductivity of 0.87 W/m/K for 0.5oz copper cladded, 0.92W/m/K for 1oz copper cladded
- CTE in X-axis of 11 ppm/°C, Y-axis of 13 ppm/°C and Z-axix of 34 ppm/°C
- Td 5% weight loss, 436°C
- Low Moisture Absorption of 0.05%