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IsoClad 917 High Frequency PCB Built on 31mil 0.787mm Substrate with Immersion Gold


Shipped:9th-Oct-2023  

We are thrilled to announce the arrival of our latest shipment of IsoClad 917 High Frequency PCB! This advanced PCB is a cutting-edge substrate that offers exceptional performance and versatility in various applications. With its unique blend of nonwoven fiberglass and PTFE composites, IsoClad 917 sets new benchmarks in dielectric constant, dissipation factor, and dimensional stability.

PCB Substrates Profile
IsoClad 917 PCB is manufactured using Rogers' innovative nonwoven fiberglass/PTFE composites. It boasts impressive specifications, including a dielectric constant (DK) of 2.17 or 2.20 at 10 GHz/23°C and an ultra-low dissipation factor of 0.0013 at the same frequency and temperature. Moreover, IsoClad 917 exhibits a TcDK of -157 ppm/°C, ensuring stable performance over a wide temperature range of -10°C to 140°C. With a moisture absorption rate of just 0.04% and controlled thermal expansion (CTE) values of 46 ppm/°C (X-axis), 47 ppm/°C (Y-axis), and 236 ppm/°C (Z-axis), IsoClad 917 offers exceptional reliability and durability.

Laminate Features
IsoClad 917 PCB comes with a host of remarkable features, making it an ideal choice for demanding applications. These features include:

1. Nonwoven Fiberglass Reinforcement: Provides enhanced flexibility compared to woven fiberglass, facilitating the use of curved or wrap-around antennas.
2. Low Dielectric Constant: Achieves one of the lowest DK values in its class, ensuring high signal integrity and minimal signal loss.
3. Extremely Low Loss: With a dissipation factor of 0.0013, IsoClad 917 minimizes energy loss, enabling high-frequency applications.
4. Low Moisture Absorption: The substrate's moisture absorption rate of 0.04% ensures stability and reliability in various environments.
5. Highly Isotropic: IsoClad 917 exhibits isotropic properties in all three axes (X, Y, and Z), enabling consistent performance across the board.
6. Stable Dk: Maintains a stable dielectric constant over a wide range of frequencies, ensuring predictable signal behavior.
7. Improved Dimensional Stability: IsoClad 917's longer random fibers and advanced manufacturing process offer superior dimensional stability and uniformity.

PCB Stackup: 2-layer rigid PCB
The 2-layer rigid stackup configuration consists of the following layers:
Copper Layer 1: 35 μm
IsoClad 917: 0.787 mm (31 mils)
Copper Layer 2: 35 μm

PCB Construction Details
The construction details of IsoClad 917 PCB are as follows:
Board Dimensions: 91.5 mm x 78 mm = 3 Types = 3 PCS, with a tolerance of +/- 0.15 mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3 mm
No Blind Vias
Finished Board Thickness: 0.9 mm
Finished Cu Weight: 1 oz (1.4 mils) on outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Silkscreen: Top Silkscreen in white, Bottom Silkscreen not applicable
Solder Mask: Top Solder Mask in green, Bottom Solder Mask not applicable
100% Electrical Test: Each board undergoes a comprehensive electrical test before shipment.

PCB Statistics
IsoClad 917 PCB's statistics showcase its capabilities:
Components: 44
Total Pads: 78
Thru Hole Pads: 45
Top SMT Pads: 33
Bottom SMT Pads: 0
Vias: 37
Nets: 3

Artwork and Standards
IsoClad 917 PCB supports Gerber RS-274-X artwork format and adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing processes and reliable performance.

Availability
IsoClad 917 PCB is available for worldwide, making it accessible for various industries and applications.

Typical Applications
IsoClad 917 laminates find applications in a wide range of industries where superior performance and flexibility are crucial. Some typical applications include:

Conformal Antennas
Stripline and Microstrip Circuits
Guidance Systems
Radar and Electronic Systems

 

Parameter

Value

1. PCB Substrates

IsoClad 917 nonwoven fiberglass/PTFE composites

Dielectric Constant (DK)

2.17 or 2.20 at 10 GHz/23°C

Dissipation Factor

0.0013 at 10 GHz/23°C

TcDK

-157 ppm/°C

Moisture Absorption Rate

0.04%

CTE Values

X-axis: 46 ppm/°C

Y-axis: 47 ppm/°C

Z-axis: 236 ppm/°C

2. Features

Nonwoven Fiberglass Reinforcement

Provides enhanced flexibility

Low Dielectric Constant

Ensures high signal integrity

Extremely Low Loss

Minimizes energy loss

Low Moisture Absorption

Ensures stability in various environments

Highly Isotropic

Exhibits consistent performance in all axes

Stable Dk

Maintains a stable dielectric constant

Improved Dimensional Stability

Offers superior dimensional stability

3. Stackup

Copper Layer 1

35 μm

IsoClad 917

0.787 mm (31 mils)

Copper Layer 2

35 μm

4. Construction Details

Board Dimensions

91.5 mm x 78 mm (3 Types = 3 PCS)

Minimum Trace/Space

5/5 mils

Minimum Hole Size

0.3 mm

Blind Vias

No

Finished Board Thickness

0.9 mm

Finished Cu Weight

1 oz (1.4 mils) on outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Silkscreen

Top Silkscreen: White<br>Bottom Silkscreen: N/A

Solder Mask

Top Solder Mask: Green<br>Bottom Solder Mask: N/A

100% Electrical Test

Yes

5. PCB Statistics

Components

44

Total Pads

78

Thru Hole Pads

45

Top SMT Pads

33

Bottom SMT Pads

0

Vias

37

Nets

3

6. Artwork and Standards

Artwork Format

Gerber RS-274-X

Standard

IPC-Class-2

7. Typical Applications

Conformal Antennas

Stripline and Microstrip Circuits

Guidance Systems

Radar and Electronic Systems

 
 
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