We are excited to announce the arrival of our latest shipment of IT-180A HDI PCB! This high-density interconnect (HDI) PCB is built on a 6-layer copper substrate, offering exceptional performance and versatility for your advanced electronic designs. With its any-interconnection capability and immersion gold finish, it provides reliable signal transmission and excellent conductivity.

Laminate Introduction
The IT-180ATC PCB material, provided by ITEQ, offers exceptional properties that make it a reliable choice for various applications. With a permittivity (Dk) of 4.5 at 1 MHz and 4.4 at 1 GHz, as well as a low loss tangent (Df) of 0.0014 at 1 MHz and 0.0015 at 1 GHz, this material ensures reliable signal transmission. It features a glass transition temperature (DSC) of 175°C, making it suitable for high-temperature environments. The decomposition temperature of 345°C ensures the stability and integrity of the material. Operating within a wide temperature range of -40°C to +130°C further enhances its versatility.

Laminate Key Features: Reliability and Performance Combined
The IT-180ATC PCB offers several key features that contribute to its reliability and performance:

Low coefficient of thermal expansion (CTE)
High heat resistance
Excellent resistance to Conductive Anodic Filamentation (CAF)
Good through-hole reliability
Stackup: 6-Layer Rigid PCB

PCB Stackup
The?configuration for the IT-180ATC PCB consists of six layers, which are as follows:

Copper Layer-1: 35 microns
Prepreg 1080: 0.075 mm
Copper Layer-2: 35 microns
Prepreg 106(72%) x2: 0.0614 mm
Copper Layer-3: 35 microns
FR-4 Core High Tg: 0.10 mm
Copper Layer-4: 35 microns
Prepreg 106(72%) x2: 0.0614 mm
Copper Layer-5: 35 microns
Prepreg 1080: 0.075 mm
Copper Layer-6: 35 microns

PCB Construction Details: Specifications for Quality Production
The construction details for the IT-180ATC PCB are as follows:

Board dimensions: 113 mm x 90 mm (20PCS), +/- 0.15 mm tolerance
Minimum Trace/Space: 3/4 mils
Minimum Hole Size: 0.10 mm (laser drill)
HDI with Blind vias and buried vias, interconnected L1-L2, L2-L3, L3-L4, L4-L5, L5-L6
Finished board thickness: 0.66 mm
Finished Cu weight: 1 oz (1.4 mils) each layer
Via plating thickness: 20 μm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
Silkscreen is forbidden onto solder pads
0.25 mm and 0.2 mm vias are filled with resin and capped as per IPC-4761 Type VII
100 ohm impedance controlled on the top layer with a 6 mil trace, reference L2
Castellated holes/half holes
100% Electrical test used prior to shipment

PCB Statistics
Components: 93
Total Pads: 153
Thru Hole Pads: 78
Top SMT Pads: 39
Bottom SMT Pads: 36
Vias: 94
Nets: 7

Artwork and Standards: Ensuring Quality and Compatibility
The artwork supplied for the IT-180ATC PCB is in Gerber RS-274-X format, adhering to the IPC-Class-2 standard. This ensures high quality and compatibility with industry standards.

Availability and Applications: Versatile and Reliable
The IT-180ATC PCB is available to worldwide and finds applications in various industries, including:

Automotive (Engine room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications