Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

IS370HR Multilayer PCB Built on 6-layer Build-up with Impedance Controlled and Immersion Gold


Shipped:7th-Oct-2023  

We are delighted to announce the arrival of our latest shipment of IS370HR multilayer PCB, built on a 6-layer build-up with impedance control and immersion gold finish! This high-quality PCB offers exceptional signal integrity and reliability for your advanced electronic designs.

Laminates Introduction:
IS370HR is a high-performance PCB material manufactured by Isola, designed to meet the demanding requirements of various industries. With its exceptional thermal performance, reliability, and impressive electrical properties, IS370HR has become a popular choice for applications where temperature tolerance and accuracy are critical.

IS370HR - High-Performance FR-4 System
IS370HR is a high-performance FR-4 system with a glass transition temperature (Tg) of 180°C, enabling it to withstand high operating temperatures. Its key material characteristics include:
Permittivity (Dk) of 3.92 at 10GHz (50% resin content)
Loss Tangent (Df) of 0.0025 at 10GHz (50% resin content)
Glass Transition Temperature (DSC) of 180°C
Decomposition Temperature (Td) of 340°C (5% weight loss)
Operating temperature range from -40°C to +130°C
RoHS compliant

Key Features for Enhanced Performance
IS370HR offers several key features that make it a reliable choice for various applications:

1. High Thermal Performance: The material's ability to withstand high temperatures and its low coefficient of thermal expansion (CTE) contribute to its excellent thermal performance.

2. High Throughput and Accuracy: IS370HR facilitates efficient fabrication and assembly processes, ensuring high throughput and accuracy during manufacturing.

3. Excellent CAF Resistance: The material exhibits excellent resistance to Conductive Anodic Filamentation (CAF), enhancing its reliability and longevity.

4. Low CTE for Reliability: The low CTE of IS370HR minimizes the risk of stress-induced failures, ensuring superior reliability.

5. T260 and T288 Values: IS370HR features T260 and T288 values of 60 minutes and 30 minutes, respectively, indicating its ability to withstand high-temperature environments.

PCB Stackup Configuration: 6-Layer Rigid PCB
The stackup for IS370HR PCBs includes the following layers and thicknesses:
Layer 1: Copper - 35 microns
Dielectric: Prepreg 370HR (1080, 65%) x 2 - 0.1347mm
Layer 2: Copper - 35 microns
Dielectric: FR-4 Core 370HR - 0.18mm
Layer 3: Copper - 35 microns
Dielectric: Prepreg 370HR (1080, 65%) x 2 - 0.1347mm
Layer 4: Copper Layer Thickness: 35 microns

PCB Construction Details and Specifications
To provide a comprehensive understanding of IS370HR PCBs, the following construction details and specifications are crucial:
Board dimensions: 122.87mm x 128.5mm (4PCS), with a tolerance of +/- 0.15mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.203mm
No Blind vias or buried vias
Finished board thickness: 1.02mm
Finished Cu weight: 1 oz (1.4 mils) each layer
Via plating thickness: 20 μm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
Silkscreen is forbidden onto solder pads
Impedance Control: 50 ohm controlled for 11mil traces on top and bottom layers, 50 ohm for 5.8mil on signal layers L3 and L4
100% Electrical test performed prior to shipment

PCB Statistics
Components: 82
Total Pads: 120
Thru Hole Pads: 67
Top SMT Pads: 28
Bottom SMT Pads: 25
Vias: 83
Nets: 6

Artwork and Standard
IS370HR PCBs use the Gerber RS-274-X artwork format and adhere to the IPC-Class-2 standard, ensuring reliable and high-quality production.

Availability and Worldwide Reach
IS370HR PCBs are readily available and can be supplied for worldwide, making them accessible for various projects and applications.

Typical Applications
IS370HR PCBs find application in diverse industries due to their exceptional thermal performance and reliability. Some typical applications include:

Multilayer Printed Circuit Boards
Computing, Storage, and Peripherals
Consumer Electronics
Networking and Communications- Medical, Industrial, and Instrumentation
Automotive and Transportation

 
 

Parameter

Value

PCB Material

Isola 370HR high-performance 180°C glass transition temperature (Tg) FR-4 system

Permittivity (Dk)

3.92 at 10GHz (50% resin content)

Loss Tangent (Df)

0.0025 at 10GHz (50% resin content)

Glass Transition Temp.

180°C (DSC)

Decomposition Temp.

340°C (Td) by TGA @ 5% weight loss

Operating Temperature

-40℃ to +130℃

Key Features

High Thermal Performance

High throughput and accuracy during PCB fabrication and assembly

Excellent CAF resistance

Low CTE for reliability

T260: 60 minutes

T288: 30 minutes

RoHS Compliant

Stackup

Copper - 35 microns

Prepreg 370HR (1080, 65%) x 2 - 0.1347mm

Copper - 35 microns

FR-4 Core 370HR - 0.18mm

Copper - 35 microns

Prepreg 370HR (1080, 65%) x 2 - 0.1347mm

Copper - 35 microns

Construction Details

Board Dimensions

122.87mm x 128.5mm = 4PCS, +/- 0.15mm

Min. Trace/Space

4/4 mils

Min. Hole Size

0.203mm

Via Type

No blind vias or buried vias

Thickness

Finished board thickness: 1.02mm

Copper Weight

Finished Cu weight: 1 oz (1.4 mils) each layer

Via Plating Thickness

20 μm

Surface Finish

Electroless Nickel Immersion Gold (ENIG)

Silkscreen

Top Silkscreen: White<br>Bottom Silkscreen: White

Solder Mask

Top Solder Mask: Green<br>Bottom Solder Mask: Green

Silkscreen Restrictions

Silkscreen is forbidden onto solder pads

Impedance Control

50 ohm impedance controlled of 11mil trace on top layer and bottom layer<br>50 ohm of 5.8mil on signal layer L3 and L4

Electrical Test

100% Electrical test used prior to shipment

PCB Statistics

Components

82

Total Pads

120

Thru Hole Pads

67

Top SMT Pads

28

Bottom SMT Pads

25

Vias

83

Nets

6

Artwork Supplied

Gerber RS-274-X

Accepted Standard

IPC-Class-2

Availability

Worldwide

Typical Applications

Multilayer Printed Circuit Boards

Applications where thermal performance and reliability are required

Computing, Storage, and peripherals

Consumer Electronics

Networking and Communications

Medical, Industrial, and Instrumentation

Automotive and Transportation

 
  PCBBACK TO OCTOBER
 
 

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3010, RO3006, RO3035, RO3203, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4730G3, RO4533, RO4534, RO4535, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, , PTFE PCB, F4B RF PCB, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917