Hybrid PCB on RO4003C and S1000-2

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6-layer 1.1mm Hybrid PCB on RO4003C and S1000-2

Shipped: 15th-April-2024

1. Introduction of RO4003C and S1000-2
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

Shengyi's S1000-2 materials are epoxy glass (FR-4) laminates with Low CTE, high thermal resistance and high Tg.

2.1 Features of RO4003C
Dk of 3.38 +/- 0.05
Dissipation factor of 0.0027 at 10 GHz
Low Z-axis coefficient of thermal expansion at 46 ppm/°C

2.2 Feastures of S1000-2
Lead-free compatible FR-4.0 laminate
Tg 170℃（DSC）,UV Blocking/AOI compatible
High heat resistance
Low Z-axis CTE of 45 ppm/℃ before Tg
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption of 0.1%

3. Hybrid PCB
Hybrid PCBs are designed to combine the benefits of different materials to meet specific requirements. RO4003C is a high-frequency laminate known for its excellent electrical performance, low loss tangent, and stable dielectric properties, making it suitable for RF and microwave applications. On the other hand, FR-4 is a widely used standard PCB material known for its cost-effectiveness and versatility.

In a hybrid PCB, the RO4003C material is typically used in specific areas or layers where high-frequency performance is critical, such as RF transmission lines or sensitive signal paths. The FR-4 material is used for other areas of the PCB where high-frequency performance is not as critical, such as power distribution or mechanical support.

By combining these materials, hybrid PCBs can achieve a balance between high-frequency performance and cost-effectiveness. They allow for the integration of high-frequency components and signals while still providing the benefits of FR-4 for other parts of the design.

4. PCB Stack-up: 6-layer rigid PCB
Copper_layer_1 - 35 μm
RO4003C Core - 0.305mm (12mil)
Copper_layer_2 - 35 μm
Prepreg - 7628 x 1 - 0.195mm (7.6mil)
Copper_layer_1 - 35 μm
S1000-2 Core - 0.25mm (10mil)
Copper_layer_2 - 35 μm
Prepreg - 7628 x 1 - 0.195mm (7.6mil)
Copper_layer_1 - 35 μm
RO4003C Core - 0.305mm (12mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 82.5mm x 66 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.35mm
- No Blind vias.
- Finished board thickness: 1.1mm
- Finished Cu weight: 1oz (1.4 mils) each layer
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Matt Green
- Bottom Solder Mask: Matt Green
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 57
Total Pads: 65
Thru Hole Pads: 41
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 76
Nets: 6

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Point to Point Digital Radio Antennas
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

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