We are thrilled to announce the arrival of our latest shipment of Hybrid PCB built on RO3010, RO3006, and RO4003C with a thickness of 2.3mm! This innovative PCB combines the strengths of these high-quality materials to provide superior performance and versatility. We are excited to introduce this advanced Hybrid PCB to you.

Laminate Introduction
RO3010: Superior Performance with Rogers Ceramic-filled PTFE Composites

Rogers RO3010 is a ceramic-filled PTFE composite substrate that offers excellent electrical and thermal performance. With a dielectric constant of 10.2+/- .30 at 10 GHz/23°C, it ensures reliable signal transmission. The low dissipation factor of 0.0022 at 10 GHz/23°C minimizes signal loss. Moreover, RO3010 exhibits remarkable thermal stability, with a decomposition temperature exceeding 500°C.

Another advantage of RO3010 is its high thermal conductivity of 0.95 W/mK, which helps dissipate heat efficiently. It also boasts a low moisture absorption rate of 0.05%, ensuring consistent performance in various environments. RO3010 is commonly employed in automotive electronics, backplanes, data storage, servers, and telecommunications applications.

RO3006: Exceptional Performance in a Compact Package

Rogers RO3006 is another ceramic-filled PTFE composite substrate that offers impressive performance characteristics. It features a dielectric constant of 6.15+/- .15 at 10 GHz/23°C, providing excellent signal integrity. The dissipation factor of 0.0020 at 10 GHz/23°C ensures minimal signal loss, making it suitable for high-frequency applications.

RO3006 exhibits a decomposition temperature exceeding 500°C, ensuring its reliability in demanding conditions. With a thermal conductivity of 0.79 W/mK, it facilitates effective heat dissipation. Additionally, its moisture absorption rate is exceptionally low at 0.02%. RO3006 finds applications in compact electronic devices, high-speed digital circuits, and RF/microwave applications.

RO4003C: Reliable Performance in Hydrocarbon Ceramic Laminates

Rogers RO4003C is a hydrocarbon ceramic laminate substrate known for its reliability and consistent performance. It features a dielectric constant of 3.38+/- .05 at 10 GHz/23°C, providing stable signal transmission. The dissipation factor of 0.0027 at 10 GHz/23°C ensures minimal signal loss, making it suitable for high-frequency applications.

RO4003C has a decomposition temperature exceeding 425°C, ensuring its durability in harsh environments. With a thermal conductivity of 0.71 W/mK, it effectively dissipates heat. Its moisture absorption rate is 0.06%, which is within acceptable limits. RO4003C is commonly used in wireless communication, aerospace, and military applications.

PCB Stackup: Achieving the Desired Configuration

To create a specific circuit board configuration, the stackup plays a crucial role. In the case of a no-copper rigid PCB, the following stackup is recommended:

RO3010: 0.635mm (25mil)
Prepreg
RO3006: 0.635mm (25mil)
Prepreg
RO4003C: 0.813mm (32mil)
This stackup ensures a balanced combination of electrical performance, thermal management, and structural integrity.

PCB Construction Details: Ensuring Quality and Reliability

When it comes to constructing circuit boards, attention to detail is essential. Here are the key construction details for your reference:

Board dimensions: 3mm x 3mm = 1PCS, +/- 0.15mm
Minimum Trace/Space: N/A
Minimum Hole Size: N/A
No Blind vias.
Finished board thickness: 2.3mm
Finished Cu weight: N/A
Via plating thickness: N/A
Surface finish: N/A
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment
These construction details ensure the board meets the necessary specifications and undergoes thorough testing before delivery.

PCB Statistics: Bare Dielectric Material with Laser Profile/Contour

In terms of PCB statistics, the focus is on the bare dielectric material with a laser profile/contour. This indicates that the material is in its raw form, ready to be processed further based on specific design requirements.

Type of Artwork Supplied: Gerber RS-274-X

The artwork supplied for PCB manufacturing is in Gerber RS-274-X format. This industry-standard file format ensures accurate representation and compatibility with PCB fabrication processes.

Accepted Standard: IPC-Class-2

To meet industry standards, the PCB design and manufacturing process adhere to IPC-Class-2 specifications. IPC-Class-2 sets the criteria for acceptable quality and workmanship in electronics manufacturing, ensuring reliability and performance.

Availability: Worldwide

The PCBs and construction services described are available for worldwide. This global accessibility allows for easy procurement and manufacturing of circuit boards regardless of geographic location.