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深圳市碧澄电子科技有限公司
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8-layer Hybrid PCB on RO3003 and High Tg FR-4

Shipped: 12th-April-2024  

1. Introduction of RO3003 and High Tg FR-4
Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites for use in printed circuit boards in commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials. This is ideal for applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave).

Shengyi S1000-2M (UL ANSI: FR-4.0) is High Tg epoxy glass circuit materials with High Performance and Low CTE. The material offers a range of impressive features that enhance its performance and manufacturability. It exhibits anti-Conductive Anodic Filament (CAF) capability, ensuring reliable performance in humid environments. Additionally, it is lead-free compatible, complying with environmental regulations and allowing for the use of lead-free soldering processes. The material demonstrates excellent thermal reliability, withstanding high temperatures and rapid temperature changes without degradation. It also provides reliable through-hole connections and maintains strong mechanical and electrical integrity. Furthermore, its excellent mechanical processability makes it easy to work with during manufacturing processes such as drilling, routing, and component assembly.

2. Features (RO3003)
Dk of 3.00 +/- .04
Dissipation factor of .0010 at 10 GHz
Low X, Y and Z axis CTE of 17, 16 and 25 ppm/°C, respectively
Excellent mechanical properties versus temperature results in Reliable stripline and multilayer board constructions and with epoxy glass multilayer board hybrid designs.
Features (S1000-2M)
Tg of greater than 180°C
CTE (Z-axis) before Tg features 41 ppm/°C
Permittivity (1GHz) exhibits 4.6
Suitable for high multilayer PCB
3. Stackup: 8-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 3003 Core - 0.127 mm
Copper_layer_2 - 18 μm
Prepreg FastRise 28 - 0.11 mm
Copper_layer_3 - 18 μm
S1000-2M FR-4 - 0.127 mm
Copper_layer_4 - 18 μm
Prepreg - 0.11 mm
Copper_layer_5 - 18 μm
S1000-2M FR-4 - 0.254 mm
Copper_layer_6 - 18 μm
Prepreg - 0.11 mm
Copper_layer_7 - 18 μm
S1000-2M FR-4 - 0.127 mm
Copper_layer_8 - 35 μm
4. Construction details:
- Board dimensions: 92.5mm x 130.05 mm=2PCS, +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.35mm
- Blind vias L1-L2
- Finished board thickness: 1.3mm
- Finished Cu weight: 0.5 oz (0.7 mils) inner layers, 1oz (1.4mil) outer layers
- Via plating thickness: 20μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Matt Black
- Bottom Solder Mask: Matt Black
- silkscreen is forbidden on solder pads
- 100% Electrical test used
- Top layer, 7mil track 50 ohm single end impedance, 9.5mil/10mil track/gap 100 ohm diffential impedance.
5. PCB Statistics:
Components: 86
Total Pads: 105
Thru Hole Pads: 62
Top SMT Pads: 43
Bottom SMT Pads: 19
Vias: 236
Nets: 15
6. Type of artwork supplied: Gerber RS-274-X
7. PCB Quality Standard: IPC-Class-2
8. Availability: worldwide
9. Some typical applications
- Patch antenna for wireless communications
- Automotive radar applications
- Direct broadcast satellites
- Cellular telecommunications systems -power amplifiers and antennas
- Datalink on cable systems
 
 
 
 
 
 
 
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