Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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Hybrid PCB on 4mil RO4835 and 370HR 6-layer

Shipped:6th-May-2024  

1. Introduction of RO4835 and 370HR
Rogers' RO4835 laminate offers enhanced stability at high temperatures and is more resistant to oxidation than other hydrocarbon materials. RO4835 laminates share similar electrical and mechanical properties with RO4350B laminates and are designed for high frequency performance and cost-effective circuit fabrication. It uses standard epoxy/glass (FR-4) processes and is competitively priced.
RO4835 laminates are a low loss material that offer low cost circuit fabrication. These laminates are available with Rogers proprietary LoPro Reverse treated copper foil, ideal for applications requiring low insertion loss.

Isolar's 370HR laminates are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. They are manufactured with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials.

2. Features of RO4835
- RoHS compliant for applications requiring UL 94 V-0
- IPC-4103 compliant
- Dielectric constant (Dk) of 3.48 +/- .05
- Dissipation factor of 0.0037 at 10 GHz
- Glass Transition Temp (Tg) >280 °C TMA
- Coefficient of Thermal Expansion of 10 ppm/°C on X axis, 12 ppm/°C on Y axix, 31 ppm/°C on Z axis.
3. Features of 370HR
- RoHS Compliant and UL 94-V0 flammability
- CAF resistant
- Dielectric constant (Dk) of 3.92 at 10 GHz
- Dissipation factor of 0.025 at 10 GHz
- Glass Transition Temperature (Tg) by DSC of 180 °C
- X/Y-Axis CTE (Pre-Tg) of 13/14 ppm/°C, 45 ppm/°C on Z axis, HDI technology compatible
4. PCB Stackup: 6-layer rigid PCB
Copper Layer-Top: 35um
RO4835 dielectric 4 mil (0.102mm)
Copper Layer-inner layer 1: 35 um
Dielectric layer - 370HR 5.67mil
Copper Layer-Inner layer 2: 35um
370HR Core - 28mil
Copper Layer-Inner layer 3: 35um
Dielectric layer - 370HR 5.67mil
Copper Layer-Inner layer 5: 35um
370HR Core - 4mil
Copper Layer-Bottom: 35um
5. Construction details:
- Board dimensions: 93.57mm x 52mm=1 PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- Via in pad and under BGA filled and capped
- Finished board thickness: 1.43mm
- Finished Cu weight: 1 oz (1.4 mils) all layers
- Via plating thickness: 1 mil
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Matt red
- Bottom Solder Mask: Matt red
- 50 ohm and 100 ohm single end impedance controlled of 5mil and 7mil on top layer
- 100% Electrical test used
6. PCB Statistics:
Components: 26
Total Pads: 77
Thru Hole Pads: 45
Top SMT Pads: 32
Bottom SMT Pads: 0
Vias: 33
Nets: 8
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Service area: worldwide
 
10. Typical Applications
- Automotive Radar and Sensors
- Point-to point Microwave
- Power Amplifiers
- Phased - Array Radar
- RF Components
 
 
 
 
  PCBBACK TO MAY
 

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