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Hybrid PCB on 20mil RO4003C and 4mil RO4350B High Frequency PCB

Shipped: 14th-FEB-2024

A hybrid PCB, also known as a mixed construction PCB, refers to a printed circuit board that incorporates multiple types of materials in its construction. It combines different substrate materials, such as FR-4 (a common fiberglass-based material) and specialized materials like ceramic, flex, or metal core laminates, within a single board.

The purpose of using a hybrid PCB is to take advantage of the unique properties and capabilities offered by different materials. Each material may be selected for its specific characteristics, such as high thermal conductivity, flexibility, high-frequency performance, or mechanical strength.

2. Features (RO4003C) - Dielectric Constant Dk of 3.38 +/- .05 - Dissipation factor of .0027 at 10GHz - Thermal coefficient of Dk of 40 ppm/°K - Coefficient of thermal expansion matched to copper, x y z : 11ppm/K, 14ppm/K, 46ppm/K - Decomposition Temperature (Td) of 425 °C TGA - Thermal Conductivity of 0.71W/mk - Tg >280°C TMA

3. Features (RO4350B) - Dielectric Constant Dk of 3.48 +/- .05 - Dissipation factor of .0037 at 10GHz - Thermal coefficient of Dk of 50 ppm/°K - Coefficient of thermal expansion matched to copper, x y z : 10ppm/K, 12ppm/K, 32ppm/K - Decomposition Temperature (Td) of 390 °C TGA - Thermal Conductivity of 0.69W/mk - Tg >280°C TMA

4. PCB Stackup: 6-layer rigid PCB Copper_layer_1 - 35 μm RogersRO4350B Core - 0.102 mm (4mil) Copper_layer_2 - 35 μm Prepreg - RO4450F - 4mil Copper_layer_1 - 35 μm RogersRO4003C Core - 0.508 mm (20mil) Copper_layer_2 - 35 μm Prepreg - RO4450F - 4mil Copper_layer_1 - 35 μm RogersRO4003C Core - 0.508 mm (20mil) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 32mm x 42 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 6/6 mils - Minimum Hole Size: 0.4mm - No Blind vias. - Finished board thickness: 1.6mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Gold - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: Green - Bottom Solder Mask: No - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 7 Total Pads: 26 Thru Hole Pads: 17 Top SMT Pads: 9 Bottom SMT Pads: 0 Vias: 9 Nets: 6

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications: - Cellular Base Station Antennas and Power Amplifiers - RF Identification Tags - Automotive Radar and Sensors - LNB's for Direct Broadcast Satellites

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